EFM32HG350F64G-A-CSP36 datasheet(8/69 Pages) SILABS

Part #	EFM32HG350F64G-A-CSP36

Description	Output state retention and wake-up from Shutoff Mode

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Preliminary

...the world's most energy friendly microcontrollers

2015-05-06 - EFM32HG350FXX - _Rev0.91

8

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3 Electrical Characteristics

3.1 Test Conditions

3.1.1 Typical Values

The typical data are based on TAMB=25°C and VDD=3.0 V, as defined in Table 3.2 (p. 8), by simu-

lation and/or technology characterisation unless otherwise specified.

3.1.2 Minimum and Maximum Values

The minimum and maximum values represent the worst conditions of ambient temperature, supply volt-

age and frequencies, as defined in Table 3.2 (p. 8), by simulation and/or technology characterisa-

tion unless otherwise specified.

3.2 Absolute Maximum Ratings

The absolute maximum ratings are stress ratings, and functional operation under such conditions are

not guaranteed. Stress beyond the limits specified in Table 3.1 (p. 8) may affect the device reliability

or cause permanent damage to the device. Functional operating conditions are given in Table 3.2 (p.

8) .

Table 3.1. Absolute Maximum Ratings

Symbol

Parameter

Condition

Min

Typ

Max

Unit

TSTG

Storage tempera-

ture range

-40

150

1

°C

TS

Maximum soldering

temperature

Latest IPC/JEDEC J-STD-020

Standard

260

°C

VDDMAX

External main sup-

ply voltage

0

3.8

V

VIOPIN

Voltage on any I/O

-0.3

VDD+0.3 V

1Based on programmed devices tested for 10000 hours at 150ºC. Storage temperature affects retention of preprogrammed cal-

ibration values stored in flash. Please refer to the Flash section in the Electrical Characteristics for information on flash data re-

tention for different temperatures.

3.3 General Operating Conditions

3.3.1 General Operating Conditions

Table 3.2. General Operating Conditions

Symbol

Parameter

Min

Typ

Max

Unit

TAMB

Ambient temperature range

-40

85

°C

VDDOP

Operating supply voltage

1.98

3.8

V

fAPB

Internal APB clock frequency

25

MHz

fAHB

Internal AHB clock frequency

25

MHz

3.3.2 Environmental

WLCSP devices can be handled and soldered using industry standard surface mount assembly tech-

niques. However, because WLCSP devices are essentially a piece of silicon and are not encapsulated

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EFM32HG350F64G-A-CSP36 Datasheet(PDF) 8 Page - Silicon Laboratories

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