TLV320AIC3206

SLAS649C – DECEMBER 2010 – REVISED NOVEMBER 2014

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Table of Contents

8.16

1

Features .................................................................. 1

8.17

SPI Interface Timing ............................................. 20

2

Applications ........................................................... 1

8.18

Typical Characteristics .......................................... 21

3

Description ............................................................. 1

9

Parameter Measurement Information ................ 23

4

Simplified Block Diagram ..................................... 1

10

Detailed Description ........................................... 23

5

Revision History..................................................... 2

10.1

Overview ............................................................... 23

6

Device Comparison Table..................................... 3

10.2

Functional Block Diagram ..................................... 24

7

Pin Configuration and Functions ......................... 4

10.3

Feature Description............................................... 24

8

Specifications......................................................... 6

10.4

Device Functional Modes...................................... 31

8.1

Absolute Maximum Ratings ...................................... 6

10.5

Register Map......................................................... 32

8.2

Handling Ratings....................................................... 7

11

Application and Implementation........................ 36

8.3

Recommended Operating Conditions ....................... 7

11.1

Application Information.......................................... 36

8.4

Thermal Information .................................................. 8

11.2

Typical Application ................................................ 36

8.5

Electrical Characteristics, ADC ................................. 8

12

Power Supply Recommendations ..................... 40

8.6

Electrical Characteristics, Bypass Outputs ............. 10

13

Layout................................................................... 40

8.7

Electrical Characteristics, Microphone Interface..... 11

13.1

Layout Guidelines ................................................. 40

8.8

Electrical Characteristics, Audio DAC Outputs ....... 12

13.2

Layout Example .................................................... 41

8.9

Electrical Characteristics, Misc. .............................. 13

14

Device and Documentation Support ................. 42

8.10

Electrical Characteristics, Logic Levels................. 14

14.1

Documentation Support ........................................ 42

8.11

Figure 1)................................................................... 14

14.2

Trademarks ........................................................... 42

8.12

14.3

Electrostatic Discharge Caution ............................ 42

Figure 2)................................................................... 15

14.4

Glossary ................................................................ 42

8.13

DSP Timing in Master Mode (see Figure 3) ......... 16

15

Mechanical, Packaging, and Orderable

8.14

DSP Timing in Slave Mode (see Figure 4) ........... 17

Information ........................................................... 42

8.15

Digital Microphone PDM Timing (see Figure 5).... 18

5 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision B (October 2012) to Revision C

Page

•

Added Pin Configuration and Functions section, Handling Rating table, Feature Description section, Device

Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout

section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information

section ................................................................................................................................................................................... 1

•

Added Note 1 to the Pin Functions table................................................................................................................................ 4

•

Added "Audio input mux ac signal swing" to the Recommended Operating Conditions table .............................................. 7

•

Changes from Revision A (December 2010) to Revision B

Page

•

Added WCSP package (YZF)................................................................................................................................................. 1

•

Corrected typos and spelling errors throughout data sheet ................................................................................................... 1

•

Updated block diagram to include Vsys pin ........................................................................................................................... 1

•

Updated diagram to include Vsys pin................................................................................................................................... 36

•

Updated power supply section to include Vsys .................................................................................................................... 40

2

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