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T521V685M050A(1)E070 Datasheet(PDF) 9 Page - Kemet Corporation |
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T521V685M050A(1)E070 Datasheet(HTML) 9 Page - Kemet Corporation |
9 / 18 page © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com T2016_T521 • 12/11/2015 99 KEMET Organic Capacitor (KO-CAP®) – Industrial T521 High Voltage Polymer Electrolytic, 12.5 – 75 VDC Reverse Voltage Polymer electrolytic capacitors are polar devices and may be permanently damaged or destroyed if connected in the wrong polarity. These devices will withstand a small degree of transient voltage reversal for short periods as shown in the below table. Temperature Permissible Transient Reverse Voltage 25°C 15% of Rated Voltage 55°C 10% of Rated Voltage 85°C 5% of Rated Voltage 105°C 3% of Rated Voltage 125°C* 1% of Rated Voltage *For series rated to 125°C Table 2 – Land Dimensions/Courtyard KEMET Metric Size Code Density Level A: Maximum (Most) Land Protrusion (mm) Density Level B: Median (Nominal) Land Protrusion (mm) Density Level C: Minimum (Least) Land Protrusion (mm) Case EIA W L S V1 V2 W L S V1 V2 W L S V1 V2 B 3528–21 2.35 2.21 0.92 6.32 4.00 2.23 1.80 1.12 5.22 3.50 2.13 1.42 1.28 4.36 3.24 D 7343–31 2.55 2.77 3.67 10.22 5.60 2.43 2.37 3.87 9.12 5.10 2.33 1.99 4.03 8.26 4.84 Q 7343-12 2.55 2.77 3.67 10.22 5.60 2.43 2.37 3.87 9.12 5.10 2.33 1.99 4.03 8.26 4.84 T 3528–12 2.35 2.20 0.92 6.32 4.00 2.23 1.80 1.12 5.22 3.50 2.13 1.42 1.28 4.36 3.24 V 7343–20 2.55 2.77 3.67 10.22 5.60 2.43 2.37 3.87 9.12 5.10 2.33 1.99 4.03 8.26 4.84 W 7343–15 2.55 2.77 3.67 10.22 5.60 2.43 2.37 3.87 9.12 5.10 2.33 1.99 4.03 8.26 4.84 X1 7343–43 2.55 2.77 3.67 10.22 5.60 2.43 2.37 3.87 9.12 5.10 2.33 1.99 4.03 8.26 4.84 Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow solder processes. Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes. Density Level C: For high component desity product applications. Before adapting the minimum land pattern variations the user should perform qualification testing based on the conditions outlined in IPC standard 7351 (IPC–7351). ¹ Height of these chips may create problems in wave soldering. 2 Land pattern geometry is too small for silkscreen outline. L S W W L V1 V2 Grid Placement Courtyard |
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