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FAN48632UC35X Datasheet(PDF) 4 Page - Fairchild Semiconductor |
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FAN48632UC35X Datasheet(HTML) 4 Page - Fairchild Semiconductor |
4 / 13 page © 2013 Fairchild Semiconductor Corporation www.fairchildsemi.com FAN48632 • Rev. 1.0.3 4 Absolute Maximum Ratings Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Symbol Parameter Min. Max. Unit VIN VIN Input Voltage -0.3 6.5 V VOUT VOUT Output Voltage 6.0 V SW Node DC -0.3 8.0 V Transient: 10 ns, 3 MHz -1.0 8.0 V Other Pins -0.3 6.5 (3) V ESD Electrostatic Discharge Protection Level Human Body Model per JESD22-A114 3.0 kV Charged Device Model per JESD22-C101 1.5 kV TJ Junction Temperature –40 +150 °C TSTG Storage Temperature –65 +150 °C TL Lead Soldering Temperature, 10 Seconds +260 °C Note: 3. Lesser of 6.5 V or VIN + 0.3 V. Recommended Operating Conditions The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to absolute maximum ratings. Symbol Parameter Min. Max. Unit VIN Supply Voltage 2.35 5.50 V IOUT Output Current 0 1500 mA TA Ambient Temperature –40 +85 °C TJ Junction Temperature –40 +125 °C Thermal Properties Junction-to-ambient thermal resistance is a function of application and board layout. This data is measured with four-layer Fairchild evaluation boards (1 oz copper on all layers). Special attention must be paid not to exceed junction temperature TJ(max) at a given ambient temperate TA. Symbol Parameter Typical Unit JA Junction-to-Ambient Thermal Resistance 80 °C/W JB Junction-to-Board Thermal Resistance 42 |
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