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UCC27526DSDR Datasheet(PDF) 6 Page - Texas Instruments |
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UCC27526DSDR Datasheet(HTML) 6 Page - Texas Instruments |
6 / 43 page UCC27523, UCC27524, UCC27525, UCC27526 SLUSAQ3G – NOVEMBER 2011 – REVISED APRIL 2015 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings (1) (2) over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT Supply voltage VDD –0.3 20 DC –0.3 VDD + 0.3 V OUTA, OUTB voltage Repetitive pulse < 200 ns(3) –2 VDD + 0.3 Output continuous source/sink IOUT_DC 0.3 current A Output pulsed source/sink current IOUT_pulsed 5 (0.5 µs) INA, INB, INA+, INA–, INB+, INB–, ENA, ENB voltage(4) –0.3 20 V Operating virtual junction temperature, TJ –40 150 Soldering, 10 s 300 °C Lead temperature Reflow 260 Storage temperature, Tstg –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltages are with respect to GND unless otherwise noted. Currents are positive into, negative out of the specified terminal. See Mechanical, Packaging, and Orderable Information for thermal limitations and considerations of packages. (3) Values are verified by characterization on bench. (4) The maximum voltage on the Input and Enable pins is not restricted by the voltage on the VDD pin. 7.2 ESD Ratings VALUE UNIT Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±4000 V(ESD) Electrostatic discharge V Charged-device model (CDM), per JEDEC specification JESD22- ±1000 C101(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT Supply voltage, VDD 4.5 12 18 V Operating junction temperature –40 140 °C Input voltage, INA, INB, INA+, INA–, INB+, INB– 0 18 V Enable voltage, ENA and ENB 0 18 7.4 Thermal Information UCC27523/4/5 UCC27524 UCC27523/4/5/6 THERMAL METRIC(1) SOIC (D) MSOP (DGN) PDIP (P) WSON (DSD) UNIT 8 PINS 8 PINS 8 PINS 8 PINS RθJA Junction-to-ambient thermal resistance 130.9 71.8 62.1 46.7 RθJC(top) Junction-to-case (top) thermal resistance 80 65.6 52.7 46.7 RθJB Junction-to-board thermal resistance 71.4 7.4 39.1 22.4 °C/W ψJT Junction-to-top characterization parameter 21.9 7.4 31 0.7 ψJB Junction-to-board characterization parameter 70.9 31.5 39.1 22.6 RθJC(bot) Junction-to-case (bottom) thermal resistance – 19.6 – 9.5 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 6 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: UCC27523 UCC27524 UCC27525 UCC27526 |
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