UCC27523, UCC27524, UCC27525, UCC27526

SLUSAQ3G – NOVEMBER 2011 – REVISED APRIL 2015

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7 Specifications

7.1 Absolute Maximum Ratings

(1) (2)

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Supply voltage

VDD

–0.3

20

DC

–0.3

VDD + 0.3

V

OUTA, OUTB voltage

–2

VDD + 0.3

Output continuous source/sink

0.3

current

A

Output pulsed source/sink current

5

(0.5 µs)

–0.3

20

V

–40

150

Soldering, 10 s

300

°C

Lead temperature

Reflow

260

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to GND unless otherwise noted. Currents are positive into, negative out of the specified terminal. See

Mechanical, Packaging, and Orderable Information for thermal limitations and considerations of packages.

(3)

Values are verified by characterization on bench.

(4)

7.2 ESD Ratings

VALUE

UNIT

±4000

Electrostatic discharge

V

Charged-device model (CDM), per JEDEC specification JESD22-

±1000

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply voltage, VDD

4.5

12

18

V

Operating junction temperature

–40

140

°C

Input voltage, INA, INB, INA+, INA–, INB+, INB–

0

18

V

Enable voltage, ENA and ENB

0

18

7.4 Thermal Information

UCC27523/4/5

UCC27524

UCC27523/4/5/6

SOIC (D)

MSOP (DGN)

PDIP (P)

WSON (DSD)

UNIT

8 PINS

8 PINS

8 PINS

8 PINS

Junction-to-ambient thermal resistance

130.9

71.8

62.1

46.7

80

65.6

52.7

46.7

Junction-to-board thermal resistance

71.4

7.4

39.1

22.4

°C/W

Junction-to-top characterization parameter

21.9

7.4

31

0.7

Junction-to-board characterization parameter

70.9

31.5

39.1

22.6

–

19.6

–

9.5

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6

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