R82EC1100-5 datasheet(3/5 Pages) KEMET

Part #	R82EC1100-5

Description	METALL IZED POLYE STER FILM CAPACITOR D.C. MUL TIPURPOSE APPLICATIONS

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Manufacturer	KEMET [Kemet Corporation]

Direct Link	http://www.kemet.com

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3 / 5 page

09/2008

28

R82

MKT Series

MeTAllIZeD POlyeSTeR FIlM CAPACITOR

D.C. MulTIPuRPOSe APPlICATIONS

p = 5 mm

PRoDUCT CoDe:

R82

eleCTRICAl ChARACTeRISTICS

Rated voltage (V

R):

50 Vdc

63 Vdc 100 Vdc

250 Vdc 400 Vdc

Rated temperature (T

R):

+85°C

Temperature derated voltage:

for temperatures between +85°C and +105°C a decreasing

factor of 1.25% per degree °C on the rated voltage V

R (d.c.

and a.c.) has to be applied.

Capacitance range:

1000pF to 4.7µF

Capacitance values:

e6 series (IeC 60063 Norm).

Capacitance tolerances (measured at 1 khz):

±5% (J); ±10% (K); ±20% (M).

Total self-inductance (l): ≈7nH

max 1 nH per 1 mm lead and capacitor length.

Dissipation factor (DF):

tgδ 10-4 at +25°C ±5°C

kHz

C

≤ 0.1µF C > 0.1µF

1

10

100

≤ 80

≤ 120

≤ 250

≤ 80

≤ 120

Insulation resistance:

Test conditions

Temperature:

+25°C±5°C

Voltage charge time:

1 min

Voltage charge:

50 Vdc for V

R <100 Vdc

100 Vdc for V

R ≥100 Vdc

Performance

For V

R ≤100 Vdc

≥ 15000 MΩ for C ≤ 0.33µF

≥ 5000 s

for C > 0.33µF and ≤1µF

≥ 1000 s

for C > 1µF

For V

R >100 Vdc

≥ 30000 MΩ

*Typical value

Test voltage between terminations:

1.4xV

R applied for 2 s at +25°C±5°C.

TeST MeThOD AND PeRFORMANCe

Damp heat, steady state:

Test conditions

Temperature:

+40°C±2°C

Relative humidity (RH):

93% ±2%

Test duration:

56 days

Performance

Capacitance change |∆C/C|: ≤ 5%

DF change (∆tgδ):

≤ 50x10-4 at 1kHz

Insulation resistance:

≥ 50% of initial limit.

endurance:

Test conditions

Temperature:

+105°C ±2°C

Test duration:

2000 h

Voltage applied:

1.25xV

C

Performance

Capacitance change |∆C/C|: ≤ 5%

DF change (∆tgδ): ≤ 30x10-4 at 10kHz for C≤1µF

≤ 20x10-4 at 1kHz

for C>1µF

Insulation resistance:

≥50% of initial limit.

Resistance to soldering heat:

Test conditions

Solder bath temperature:

+260°C±5°C

Dipping time (with heat screen):10 s ±1 s

Performance

Capacitance change |∆C/C|: ≤2%

DF change (∆tgδ):

≤ 30x10-4 at 10kHz for C≤ 1µF

≤ 20x10-4 at 1kHz for C> 1µF

Insulation resistance:

≥ initial limit.

long term stability (after two years):

Storage: standard environmental conditions (see page 12).

Performance

Capacitance change |∆C/C|: ≤ 3% for C≤ 0.1µF

≤ 2% for C> 0.1µF

RelIABIlITy:

Reference MIL HDB 217

Application conditions:

Temperature:

+40°C±2°C

Voltage:

0.5xV

R

Failure rate:

≤ 1 FIT

(1 FIT = 1x10-9 failures/components x h)

Failure criteria:

(according to DIN 44122)

Short or open circuit

Capacitance change |∆C/C|: > 10%

DF change (∆tgδ):

> 2 x initial limit.

Insulation resistance:

< 0.005 x initial limit.

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