TLV3691

SBOS694A – DECEMBER 2013 – REVISED NOVEMBER 2015

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage

7

V

(V–) – 0.5

(V+) + 0.5

V

Signal input terminals

±10

mA

Continuous

mA

–55

150

Temperature

150

°C

–65

150

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5 V beyond the supply rails should

be current-limited to 10 mA or less.

(3)

Short-circuit to ground, one comparator per package.

6.2 ESD Ratings

VALUE

UNIT

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all

±2500

Electrostatic discharge

V

Charged device model (CDM), per JEDEC specification JESD22-

±1000

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Power supply voltage

0.9

6.5

V

–40

125

°C

6.4 Thermal Information

TLV3691

DCK (SC70)

DPF (X2SON)

UNIT

5 PINS

6 PINS

Junction-to-ambient thermal resistance

297.4

252.4

°C/W

Junction-to-case (top) thermal resistance

109.3

93.9

°C/W

Junction-to-board thermal resistance

74.4

192.8

°C/W

Junction-to-top characterization parameter

3

3

°C/W

Junction-to-board characterization parameter

73.6

203.8

°C/W

Junction-to-case (bottom) thermal resistance

N/A

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

4

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