INA282-Q1, INA283-Q1, INA284-Q1, INA285-Q1, INA286-Q1

SBOS554B – MARCH 2012 – REVISED DECEMBER 2015

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range, unless otherwise noted.

(1)

MIN

MAX

UNIT

Supply voltage, V+

18

V

(3)

–5

5

V

Analog inputs,

(2)

Common-Mode

–14

80

V

REF1, REF2, OUT

GND–0.3

(V+) + 0.3

V

Input current into any pin

5

mA

Junction temperature

150

°C

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

(3)

Input voltages must not exceed common-mode rating.

6.2 ESD Ratings

VALUE

UNIT

±2000

Electrostatic discharge

V

Charged device model (CDM), per AEC Q100-011

±750

(1)

AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Common-mode input voltage

12

V

V+

Operating supply voltage

5

V

Operating free-air temperature

–40

125

°C

6.4 Thermal Information

INA28x-Q1

D (SOIC)

DGK (VSSOP)

UNIT

8 PINS

8 PINS

Junction-to-ambient thermal resistance

134.9

164.1

°C/W

Junction-to-case (top) thermal resistance

72.9

56.4

°C/W

Junction-to-board thermal resistance

61.3

85.0

°C/W

Junction-to-top characterization parameter

18.9

6.5

°C/W

Junction-to-board characterization parameter

54.3

83.3

°C/W

Junction-to-case (bottom) thermal resistance

n/a

n/a

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

4

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