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INA282AQDRQ1 Datasheet(PDF) 4 Page - Texas Instruments |
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INA282AQDRQ1 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 34 page INA282-Q1, INA283-Q1, INA284-Q1, INA285-Q1, INA286-Q1 SBOS554B – MARCH 2012 – REVISED DECEMBER 2015 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range, unless otherwise noted. (1) MIN MAX UNIT Supply voltage, V+ 18 V Differential (V+IN) – (V–IN) (3) –5 5 V Analog inputs, V+IN, V–IN (2) Common-Mode –14 80 V REF1, REF2, OUT GND–0.3 (V+) + 0.3 V Input current into any pin 5 mA Junction temperature 150 °C Storage temperature, Tstg –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) V+IN and V–IN are the voltages at the +IN and –IN pins, respectively. (3) Input voltages must not exceed common-mode rating. 6.2 ESD Ratings VALUE UNIT Human body model (HBM), per AEC Q100-002(1) ±2000 V(ESD) Electrostatic discharge V Charged device model (CDM), per AEC Q100-011 ±750 (1) AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VCM Common-mode input voltage 12 V V+ Operating supply voltage 5 V TA Operating free-air temperature –40 125 °C 6.4 Thermal Information INA28x-Q1 THERMAL METRIC(1) D (SOIC) DGK (VSSOP) UNIT 8 PINS 8 PINS RθJA Junction-to-ambient thermal resistance 134.9 164.1 °C/W RθJC(top) Junction-to-case (top) thermal resistance 72.9 56.4 °C/W RθJB Junction-to-board thermal resistance 61.3 85.0 °C/W ψJT Junction-to-top characterization parameter 18.9 6.5 °C/W ψJB Junction-to-board characterization parameter 54.3 83.3 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: INA282-Q1 INA283-Q1 INA284-Q1 INA285-Q1 INA286-Q1 |
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