INA199

SBOS469E – APRIL 2009 – REVISED DECEMBER 2015

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7.4 Thermal Information

INA199

DCK (SC70)

RSW (UQFN)

UNIT

6 PINS

10 PINS

Junction-to-ambient thermal resistance

227.3

107.3

°C/W

Junction-to-case (top) thermal resistance

79.5

56.5

°C/W

Junction-to-board thermal resistance

72.1

18.7

°C/W

Junction-to-top characterization parameter

3.6

1.1

°C/W

Junction-to-board characterization parameter

70.4

18.7

°C/W

Junction-to-case (bottom) thermal resistance

—

—

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

INPUT

±5

±150

μV

PSR

Power supply rejection

±0.1

μV/V

Input bias current

28

μA

Input offset current

±0.02

μA

OUTPUT

INA199x1

50

V/V

G

Gain

INA199x2

100

V/V

INA199x3

200

V/V

Nonlinearity error

±0.01%

Maximum capacitive load

No Sustained Oscillation

1

nF

FREQUENCY RESPONSE

80

kHz

and INA199B1

GBW Bandwidth

30

kHz

and INA199B2

14

kHz

and INA199B3

SR

Slew rate

0.4

V/

μs

Voltage Noise Density

25

nV/

√Hz

POWER SUPPLY

Operating voltage range

–20°C to 85°C

26

V

Quiescent current

65

100

μA

TEMPERATURE RANGE

Specified range

–40

105

°C

Operating range

–40

125

°C

(1)

RTI = Referred-to-input.

6

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