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BQ500100DCKR Datasheet(PDF) 4 Page - Texas Instruments

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Part # BQ500100DCKR
Description  High-Side Current Sensor for Wireless Charging
Download  18 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

BQ500100DCKR Datasheet(HTML) 4 Page - Texas Instruments

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bq500100
SBOS765 – JANUARY 2016
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
Supply voltage
7
V
Differential (VIN+) – (VIN–)
–26
26
Analog inputs, VIN+, VIN–
(2)
V
Common-mode(3)
GND – 0.3
26
Output(3)
GND – 0.3
(V+) + 0.3
V
Input current Into all pins(3)
5
mA
Operating, TA
–40
125
Temperature
Junction, TJ
150
°C
Storage, Tstg
–65
150
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
VIN+ and VIN– are the voltages at the IN+ and IN– pins, respectively.
(3)
Input voltage at any pin can exceed the voltage shown if the current at that pin is limited to 5 mA.
6.2 ESD Ratings
VALUE
UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2000
V(ESD)
Electrostatic discharge
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)
±1000
V
Machine model (MM)
±200
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
VCM
Common-mode input voltage
12
V
VS
Operating supply voltage (applied to V+)
3.3
V
TA
Operating free-air temperature
–40
105
°C
6.4 Thermal Information
bq500100
THERMAL METRIC(1)
DCK (SC70)
UNIT
6 PINS
RθJA
Junction-to-ambient thermal resistance
227.3
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
79.5
°C/W
RθJB
Junction-to-board thermal resistance
72.1
°C/W
ψJT
Junction-to-top characterization parameter
3.6
°C/W
ψJB
Junction-to-board characterization parameter
70.4
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
N/A
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4
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Copyright © 2016, Texas Instruments Incorporated
Product Folder Links: bq500100


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