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BQ500100DCKR Datasheet(PDF) 4 Page - Texas Instruments |
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BQ500100DCKR Datasheet(HTML) 4 Page - Texas Instruments |
4 / 18 page bq500100 SBOS765 – JANUARY 2016 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Supply voltage 7 V Differential (VIN+) – (VIN–) –26 26 Analog inputs, VIN+, VIN– (2) V Common-mode(3) GND – 0.3 26 Output(3) GND – 0.3 (V+) + 0.3 V Input current Into all pins(3) 5 mA Operating, TA –40 125 Temperature Junction, TJ 150 °C Storage, Tstg –65 150 (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) VIN+ and VIN– are the voltages at the IN+ and IN– pins, respectively. (3) Input voltage at any pin can exceed the voltage shown if the current at that pin is limited to 5 mA. 6.2 ESD Ratings VALUE UNIT Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V(ESD) Electrostatic discharge Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000 V Machine model (MM) ±200 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VCM Common-mode input voltage 12 V VS Operating supply voltage (applied to V+) 3.3 V TA Operating free-air temperature –40 105 °C 6.4 Thermal Information bq500100 THERMAL METRIC(1) DCK (SC70) UNIT 6 PINS RθJA Junction-to-ambient thermal resistance 227.3 °C/W RθJC(top) Junction-to-case (top) thermal resistance 79.5 °C/W RθJB Junction-to-board thermal resistance 72.1 °C/W ψJT Junction-to-top characterization parameter 3.6 °C/W ψJB Junction-to-board characterization parameter 70.4 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: bq500100 |
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