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LMV7231SQ Datasheet(PDF) 4 Page - Texas Instruments

Part # LMV7231SQ
Description  Hex Window Comparator With 1.5% Precision and 400-mV Reference
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

LMV7231SQ Datasheet(HTML) 4 Page - Texas Instruments

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LMV7231
SNOSB45F – FEBRUARY 2010 – REVISED JANUARY 2016
www.ti.com
Product Folder Links: LMV7231
Submit Documentation Feedback
Copyright © 2010–2016, Texas Instruments Incorporated
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3)
For soldering specifications, see Absolute Maximum Ratings for Soldering (SNOA549).
(4)
The maximum power dissipation is a function of TJ(MAX), RθJA. The maximum allowable power dissipation at any ambient temperature is
PD = (TJ(MAX) – TA) / RθJA. All numbers apply for packages soldered directly onto a PCB.
6 Specifications
6.1 Absolute Maximum Ratings
See
(1) (2) (3).
MIN
MAX
UNIT
Supply voltage
6
V
Voltage at input / output pin
GND
− 0.3
6
V
Output current
10
mA
Total package current
50
mA
Junction temperature(4)
150
°C
Storage temperature, Tstg
–65
150
°C
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of
JEDEC) Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
6.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)(2)
±2000
V
Machine model
±200
(1)
The maximum power dissipation is a function of TJ(MAX), RθJA. The maximum allowable power dissipation at any ambient temperature is
PD = (TJ(MAX) – TA) / RθJA. All numbers apply for packages soldered directly onto a PCB.
6.3 Recommended Operating Conditions
MIN
MAX
UNIT
Supply voltage
2.2
5.5
V
Junction temperature(1)
–40
125
°C


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