Revision: I

3/27/2013

Sheet 10 of 11

©2013 Knowles Electronics

SPUL409HE5H-PB

12. RELIABILITY SPECIFICATIONS

Test

Description

Thermal Shock

100 cycles air-to-air thermal shock from -40

minute soaks. (IEC 68-2-4)

High Temperature Storage

1,000 hours at +105

Low Temperature Storage

1,000 hours at -40

High Temperature Bias

1,000 hours at +105

Low Temperature Bias

1,000 hours at -40

Temperature / Humidity Bias

1,000 hours at +85

Vibration

4 cycles of 20 to 2,000 Hz sinusoidal sweep with 20 G peak

acceleration lasting 12 minutes in X, Y, and Z directions.

(Mil-Std-883E, Method 2007.2 A)

ESD-HBM

3 discharges of ±2 kV direct contact to I/O pins.

(MIL 883E, Method 3015.7)

ESD-LID/GND

3 discharges of ±8 kV direct contact to lid while unit is grounded.

(IEC 61000-4-2)

ESD-MM

3 discharges of ±200 V direct contact to I/O pins.

(ESD STM5.2)

Reflow

5 reflow cycles with peak temperature of +260

Mechanical Shock

3 pulses of 10,000 G in the X, Y, and Z direction (IEC 68-2-27, Test Ea)

Note: After reliability tests are performed, the sensitivity of the microphones shall not deviate

more than 3 dB from its initial value.