OPA314, OPA2314, OPA4314

SBOS563G – MAY 2011 – REVISED JUNE 2015

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6 Specifications

6.1 Absolute Maximum Ratings

Over operating free-air temperature range, unless otherwise noted.

(1)

MIN

MAX

UNIT

Supply voltage

7

V

(V–) – 0.5

(V+) + 0.5

V

Signal input terminals

–10

10

mA

Continuous

mA

–40

150

°C

°C

–65

150

°C

(1)

Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not supported.

(2)

Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5 V beyond the supply rails should

be current limited to 10 mA or less.

(3)

Short-circuit to ground, one amplifier per package.

6.2 ESD Ratings

VALUE

UNIT

±4000

Charged-device model (CDM), per JEDEC specification JESD22-

Electrostatic discharge

±1000

V

Machine model (MM)

±200

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply voltage

1.8 (±0.9)

5.5 (±2.75)

V

Ambient operating temperature

–40

125

°C

6.4 Thermal Information: OPA314

OPA314

DBV (SOT23)

DCK (SC70)

DRL (SOT553)

UNIT

5 PINS

5 PINS

5 PINS

Junction-to-ambient thermal resistance

228.5

281.4

208.1

°C/W

Junction-to-case(top) thermal resistance

99.1

91.6

0.1

°C/W

Junction-to-board thermal resistance

54.6

59.6

42.4

°C/W

Junction-to-top characterization parameter

7.7

1.5

0.5

°C/W

Junction-to-board characterization parameter

53.8

58.8

42.2

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6

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