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LM8272 Datasheet(PDF) 4 Page - Texas Instruments

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Part # LM8272
Description  Dual RRIO, High Output Current & Unlimited Cap Load
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

LM8272 Datasheet(HTML) 4 Page - Texas Instruments

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LM8272
SNOS515F – OCTOBER 2000 – REVISED AUGUST 2015
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
(1) (2)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
VIN Differential
+/
−10
V
Output Short Circuit Duration
See(3)(4)
Supply Voltage (V+ - V)
27
V
Voltage at Input/Output pins
V+ +0.3, V
−0.3
V
Junction Temperature(5)
+150
°C
Storage temperature range, Tstg
−65
+150
°C
Soldering Information:
Infrared or Convection (20 sec.)
235
°C
Wave Soldering (10 sec.)
260
°C
(1)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Rating indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2)
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3)
Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in
exceeding the maximum allowed junction temperature of 150°C.
(4)
Output short circuit duration is infinite for VS
≤ 6 V at room temperature and below. For VS > 6 V, allowable short circuit duration is 1.5
ms.
(5)
The maximum power dissipation is a function of TJ(max), RθJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(max) - TA)/ RθJA. All numbers apply for packages soldered directly onto a PC board.
6.2 ESD Ratings
VALUE
UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(2)
±2000
V(ESD)
Electrostatic discharge(1)
V
Machine Model (MM)(3)
±200
(1)
Human body model, 1.5 k
Ω in series with 100 pF. Machine Model, 0 Ω is series with 200 pF.
(2)
JEDEC document JEP155 states that 2000-V HBM allows safe manufacturing with a standard ESD control process.
(3)
JEDEC document JEP157 states that 200-V MM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
Supply Voltage (V+ - V)
2.5
24
V
Operating Temperature Range(1)
−40
+85
°C
(1)
The maximum power dissipation is a function of TJ(max), RθJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(max) - TA)/ RθJA. All numbers apply for packages soldered directly onto a PC board.
6.4 Thermal Information
DGK
THERMAL METRIC(1)
UNIT
8 Pins
RθJA
Junction-to-ambient thermal resistance(2)
235
°C/W
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2)
The maximum power dissipation is a function of TJ(max), RθJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(max) - TA)/ RθJA. All numbers apply for packages soldered directly onto a PC board.
4
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