LPV321, LPV324-N, LPV358-N

SNOS413D – AUGUST 2000 – REVISED MARCH 2013

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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1) (2)

Human Body Model

LPV324

2000V

LPV358

1500V

LPV321-N

1500V

Machine Model

100V

Differential Input Voltage

±Supply Voltage

5.5V

(4)

(5)

Soldering Information

Infrared or Convection (20 sec)

235°C

Storage Temperature Range

−65°C to 150°C

(6)

150°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test

conditions, see the Electrical Characteristics.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(3)

Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of

JEDEC)Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).

(4)

(5)

(6)

Operating Ratings

(1)

Supply Voltage

2.7V to 5V

Temperature Range

−40°C to +85°C

Thermal Resistance (

(2)

5-Pin SC70

478°C/W

5-Pin SOT-23

265°C/W

8-Pin SOIC

190°C/W

8-Pin VSSOP

235°C/W

14-Pin SOIC

145°C/W

14-Pin TSSOP

155°C/W

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test

conditions, see the Electrical Characteristics.

(2)

All numbers are typical, and apply for packages soldered directly onto a PC board in still air.

2

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