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Material Content Data Sheet

Sales Product Name

IDD03SG60C

Issued

29. August 2013

MA#

MA000809442

Package

PG-TO252-3-311

Weight*

311.74 mg

Construction Element

Material Group

Substances

CAS#

if applicable

Weight

[mg]

Average

Mass

[%]

Sum

[%]

Average

Mass

[ppm]

Sum

[ppm]

chip

noble metal

gold

7440-57-5

0.032

0.01

101

non noble metal

tin

7440-31-5

0.008

0.00

26

inorganic material

silicon

7440-21-3

0.401

0.13

0.14

1288

1415

leadframe

non noble metal

iron

7439-89-6

0.162

0.05

521

inorganic material

phosphorus

7723-14-0

0.049

0.02

156

non noble metal

copper

7440-50-8

162.275

52.06

52.13

520539

521216

wire

non noble metal

aluminium

7429-90-5

0.126

0.04

0.04

403

403

encapsulation

organic material

carbon black

1333-86-4

1.449

0.46

4647

plastics

epoxy resin

-

25.351

8.13

81321

inorganic material

silicondioxide

60676-86-0

118.065

37.87

46.46

378723

464691

leadfinish

non noble metal

tin

7440-31-5

3.740

1.20

1.20

11997

11997

plating

non noble metal

nickel

7440-02-0

0.086

0.03

277

inorganic material

phosphorus

7723-14-0

0.000

0.00

0.03

1

278

*deviation

< 10%

Sum in total:

100,00

1000000

Important Remarks:

Infineon Technologies AG provides full material declaration based on information provided by third parties and

has taken and continues to take reasonable steps to provide representative and accurate information.

Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be

proprietary, and thus CAS numbers and other limited information may not be available for release.

All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any

time due to technical requirements and development without notification.

Company

Infineon Technologies AG

Address

81726 München

Internet

www.infineon.com