Matched Broadband RF VGA

400MHz to 2700MHz

Glitch-Free

2

Rev 3, April 2015

IDTF0480NBGI

Datasheet

Parameter

Symbol

Min

Max

Units

VCC to GND

-0.3

+5.5

V

SPI DATA, SPI CSb, SPI CLK, LogicCTL

-0.3

+3.6

V

STBY, Band_Select

-0.3

V

R_Bias1

+1.5

mA

R_Bias2

+0.8

mA

RFIN externally applied DC voltage

+1.4

+3.6

V

RFOUT externally applied DC voltage

V

RF Input Power (RFIN) applied for 24

hours maximum

+22

dBm

Continuous Power Dissipation

1.5

W

Junction Temperature

150

°C

Storage Temperature Range

-65

150

°C

Lead Temperature (soldering, 10s)

260

°C

ElectroStatic Discharge – HBM

(JEDEC/ESDA JS-001-2012)

Class 2

(2000 V)

ElectroStatic Discharge – CDM

(JEDEC 22-C101F)

Class C2

(500 V)

Stresses above those listed above may cause permanent damage to the device. Functional operation of the device at

these or any other conditions above those indicated in the operational section of this specification is not implied.

Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

40 °C/W

4 °C/W

Moisture Sensitivity Rating (Per J-STD-020)

MSL1