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OPA836IDBVT Datasheet(PDF) 6 Page - Texas Instruments |
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OPA836IDBVT Datasheet(HTML) 6 Page - Texas Instruments |
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6 / 57 page  OPA836, OPA2836 SLOS712G – JANUARY 2011 – REVISED OCTOBER 2015 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VS– to VS+ Supply voltage 5.5 V VI Input voltage VS– – 0.7 VS+ + 0.7 V VID Differential input voltage 1 V II Continuous input current 0.85 mA IO Continuous output current 60 mA See Thermal Information: OPA836 Continuous power dissipation and Thermal Information: OPA2836 TJ Maximum junction temperature 150 °C TA Operating free-air temperature –40 125 °C Tstg Storage temperature –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7.2 ESD Ratings VALUE UNIT Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±6000 V(ESD) Electrostatic discharge Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000 V Machine model ±200 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VS+ Single supply voltage 2.5 5 5.5 V TA Ambient temperature –40 25 125 °C 7.4 Thermal Information: OPA836 OPA836 SOT23-6 WQFN-10 THERMAL METRIC(1) UNIT (DBV) (RUN) 6 PINS 10 PINS RθJA Junction-to-ambient thermal resistance 194 145.8 °C/W RθJC(top) Junction-to-case (top) thermal resistance 129.2 75.1 °C/W RθJB Junction-to-board thermal resistance 39.4 38.9 °C/W ψJT Junction-to-top characterization parameter 25.6 13.5 °C/W ψJB Junction-to-board characterization parameter 38.9 104.5 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 6 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: OPA836 OPA2836 |
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