LMH6658MM datasheet(4/35 Pages) TI1

Part #	LMH6658MM

Description	270-MHz Single Supply, Single and Dual Amplifiers

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Manufacturer	TI1 [Texas Instruments]

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LMH6657, LMH6658

SNOSA35G – AUGUST 2002 – REVISED JULY 2015

www.ti.com

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VIN Differential

±2.5

V

Output Short Circuit Duration

See (2)(3)

Input Current

±10

mA

Supply Voltage (V+ - V−)

12.6

V

Voltage at Input/Output pins

V−

− 0.8

V+ + 0.8

V

Infrared or Convection (20 sec.)

260

Soldering Information

°C

Wave Soldering (10 sec.)

260

Storage temperature, Tstg

–65

100

°C

Junction Temperature(4)

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in

exceeding the maximum allowed junction temperature of 150°C.

(3)

Output short circuit duration is infinite for VS < 6 V at room temperature and below. For VS > 6 V, allowable short circuit duration is

1.5ms.

(4)

The maximum power dissipation is a function of TJ(MAX), RθJA, and TA. The maximum allowable power dissipation at any ambient

temperature is PD = (TJ(MAX) - TA)/ RθJA . All numbers apply for packages soldered directly onto a PCB.

6.2 ESD Ratings

VALUE

UNIT

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)(2)

±2000

V(ESD)

Electrostatic discharge

V

Machine Model(3)

±200

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 500-V HBM is possible with the necessary precautions. Pins listed as ±2000 V may actually have higher performance.

(2)

Human body model, 1.5 k

Ω in series with 100 pF.

(3)

Machine Model, 0

Ω in series with 200 pF.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Supply Voltage (V+ – V−)

3

12

V

Operating Temperature(1)

−40

85

°C

(1)

The maximum power dissipation is a function of TJ(MAX), RθJA, and TA. The maximum allowable power dissipation at any ambient

temperature is PD = (TJ(MAX) - TA)/ RθJA . All numbers apply for packages soldered directly onto a PCB.

6.4 Thermal Information

LMH6657

LMH6658

DBV (SOT-

DGK

THERMAL METRIC(1)

DCK (SC70)

D (SOIC)

UNIT

23)

(VSSOP)

5 PINS

8 PINS

RθJA

Junction-to-ambient thermal resistance(2)

265

478

190

235

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

(2)

The maximum power dissipation is a function of TJ(MAX), RθJA, and TA. The maximum allowable power dissipation at any ambient

temperature is PD = (TJ(MAX) - TA)/ RθJA . All numbers apply for packages soldered directly onto a PCB.

4

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