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LMH6658MM Datasheet(PDF) 4 Page - Texas Instruments |
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LMH6658MM Datasheet(HTML) 4 Page - Texas Instruments |
4 / 35 page LMH6657, LMH6658 SNOSA35G – AUGUST 2002 – REVISED JULY 2015 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VIN Differential ±2.5 V Output Short Circuit Duration See (2)(3) Input Current ±10 mA Supply Voltage (V+ - V−) 12.6 V Voltage at Input/Output pins V− − 0.8 V+ + 0.8 V Infrared or Convection (20 sec.) 260 Soldering Information °C Wave Soldering (10 sec.) 260 Storage temperature, Tstg –65 100 °C Junction Temperature(4) 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in exceeding the maximum allowed junction temperature of 150°C. (3) Output short circuit duration is infinite for VS < 6 V at room temperature and below. For VS > 6 V, allowable short circuit duration is 1.5ms. (4) The maximum power dissipation is a function of TJ(MAX), RθJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) - TA)/ RθJA . All numbers apply for packages soldered directly onto a PCB. 6.2 ESD Ratings VALUE UNIT Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)(2) ±2000 V(ESD) Electrostatic discharge V Machine Model(3) ±200 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 500-V HBM is possible with the necessary precautions. Pins listed as ±2000 V may actually have higher performance. (2) Human body model, 1.5 k Ω in series with 100 pF. (3) Machine Model, 0 Ω in series with 200 pF. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT Supply Voltage (V+ – V−) 3 12 V Operating Temperature(1) −40 85 °C (1) The maximum power dissipation is a function of TJ(MAX), RθJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) - TA)/ RθJA . All numbers apply for packages soldered directly onto a PCB. 6.4 Thermal Information LMH6657 LMH6658 DBV (SOT- DGK THERMAL METRIC(1) DCK (SC70) D (SOIC) UNIT 23) (VSSOP) 5 PINS 8 PINS RθJA Junction-to-ambient thermal resistance(2) 265 478 190 235 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. (2) The maximum power dissipation is a function of TJ(MAX), RθJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) - TA)/ RθJA . All numbers apply for packages soldered directly onto a PCB. 4 Submit Documentation Feedback Copyright © 2002–2015, Texas Instruments Incorporated Product Folder Links: LMH6657 LMH6658 |
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