NCP308, NCV308

www.onsemi.com

11

PACKAGE DIMENSIONS

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED

TERMINAL AND IS MEASURED BETWEEN

0.15 AND 0.25 mm FROM THE TERMINAL TIP.

4. COPLANARITY APPLIES TO THE EXPOSED

PAD AS WELL AS THE TERMINALS.

SEATING

PLANE

D

E

0.10 C

A3

A

A1

0.10 C

WDFN6 2x2, 0.65P

CASE 511BR

ISSUE O

DIM

A

MIN

MAX

MILLIMETERS

0.70

0.80

A1

0.00

0.05

A3

0.20 REF

b

0.25

0.35

D

2.00 BSC

D2

1.50

1.70

0.90

1.10

E

2.00 BSC

E2

e

0.65 BSC

0.20

0.40

L

PIN ONE

REFERENCE

0.05 C

0.05 C

NOTE 4

A

0.10

C

NOTE 3

L

e

D2

E2

b

B

3

6

6X

1

4

0.05

C

MOUNTING FOOTPRINT*

BOTTOM VIEW

RECOMMENDED

DIMENSIONS: MILLIMETERS

L1

DETAIL A

L

ALTERNATE

CONSTRUCTIONS

L

DETAIL B

MOLD CMPD

EXPOSED Cu

ALTERNATE

CONSTRUCTIONS

DETAIL A

DETAIL B

A

B

TOP VIEW

C

SIDE VIEW

---

0.15

L1

6X

0.45

2.30

1.12

1.72

0.65

PITCH

6X

0.40

1

PACKAGE

OUTLINE

6X

M

M

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

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NCP308/D

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