NCP308, NCV308

www.onsemi.com

10

PACKAGE DIMENSIONS

TSOP−6

CASE 318G−02

ISSUE U

23

4

5

6

D

1

e

b

E1

A1

A

0.05

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM

LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.

4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH,

PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR

GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSIONS D

AND E1 ARE DETERMINED AT DATUM H.

5. PIN ONE INDICATOR MUST BE LOCATED IN THE INDICATED ZONE.

c

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

DIM

A

MIN

NOM

MAX

MILLIMETERS

0.90

1.00

1.10

A1

0.01

0.06

0.10

b

0.25

0.38

0.50

c

0.10

0.18

0.26

D

2.90

3.00

3.10

E

2.50

2.75

3.00

e

0.85

0.95

1.05

L

0.20

0.40

0.60

0.25 BSC

L2

−

0

°

10

°

1.30

1.50

1.70

E1

E

RECOMMENDED

NOTE 5

L

C

M

H

L2

SEATING

PLANE

GAUGE

PLANE

DETAIL Z

DETAIL Z

0.60

6X

3.20

0.95

6X

0.95

PITCH

DIMENSIONS: MILLIMETERS

M