NCP81251

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5

Table 2. MAXIMUM RATINGS

Rating

Symbol

Value

Unit

Min

Max

Power Supply Voltage to PGND

30

V

Switch Node to PGND

30

V

Analog Supply Voltage to GND

−0.3

6.5

V

BST to PGND

BST_PGND

−0.3

33

38 (<50 ns)

V

BST to SW

BST_SW

−0.3

6.5

V

GH to SW

GH

−0.3

−2 (<200 ns)

BST+0.3

V

GL to GND

GL

−0.3

−2 (<200 ns)

VCCP+0.3

V

VSN to GND

VSN

−0.3

0.3

V

IOUT

IOUT

−0.3

2.5

V

PGND to GND

PGND

−0.3

0.3

V

Other Pins

−0.3

VCC+0.3

V

Latch up Current: (Note 1)

All pins, except digital pins

Digital pins

−100

−10

100

10

mA

Operating Junction Temperature Range

−40

125

°C

Operating Ambient Temperature Range

−40

125

°C

Storage Temperature Range

−40

150

°C

Thermal Resistance Junction to Board (Note 2)

8.2

°C/W

Thermal Resistance Junction to Ambient (Note 2)

21.8

°C/W

4.59

W

Moisture Sensitivity Level (Note 4)

MSL

3

−

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

1. Latch up Current per JEDEC standard: JESD78 class II.

2. The thermal resistance values are dependent of the internal losses split between devices and the PCB heat dissipation. This data is based

on a typical operation condition with a 4−layer FR−4 PCB board, which has two, 1−ounce copper internal power and ground planes and

2−ounce copper traces on top and bottom layers with approximately 80% copper coverage. No airflow and no heat sink applied (reference

EIA/JEDEC 51.7). It also does not account for other heat sources that may be present on the PCB next to the device in question (such as

inductors, resistors etc.)

3. The maximum power dissipation (PD) is dependent on input voltage, output voltage, output current, external components selected, and PCB

4. Moisture Sensitivity Level (MSL): 3 per IPC/JEDEC standard: J−STD−020D.1.