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NCP81251 Datasheet(PDF) 5 Page - ON Semiconductor |
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NCP81251 Datasheet(HTML) 5 Page - ON Semiconductor |
5 / 18 page NCP81251 www.onsemi.com 5 Table 2. MAXIMUM RATINGS Rating Symbol Value Unit Min Max Power Supply Voltage to PGND VVIN 30 V Switch Node to PGND VSW 30 V Analog Supply Voltage to GND VCC, VCCP −0.3 6.5 V BST to PGND BST_PGND −0.3 33 38 (<50 ns) V BST to SW BST_SW −0.3 6.5 V GH to SW GH −0.3 −2 (<200 ns) BST+0.3 V GL to GND GL −0.3 −2 (<200 ns) VCCP+0.3 V VSN to GND VSN −0.3 0.3 V IOUT IOUT −0.3 2.5 V PGND to GND PGND −0.3 0.3 V Other Pins −0.3 VCC+0.3 V Latch up Current: (Note 1) All pins, except digital pins Digital pins ILU −100 −10 100 10 mA Operating Junction Temperature Range TJ −40 125 °C Operating Ambient Temperature Range TA −40 125 °C Storage Temperature Range TSTG −40 150 °C Thermal Resistance Junction to Board (Note 2) RθJB 8.2 °C/W Thermal Resistance Junction to Ambient (Note 2) RθJA 21.8 °C/W Power Dissipation at TA = 25°C (Note 3) PD 4.59 W Moisture Sensitivity Level (Note 4) MSL 3 − Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Latch up Current per JEDEC standard: JESD78 class II. 2. The thermal resistance values are dependent of the internal losses split between devices and the PCB heat dissipation. This data is based on a typical operation condition with a 4−layer FR−4 PCB board, which has two, 1−ounce copper internal power and ground planes and 2−ounce copper traces on top and bottom layers with approximately 80% copper coverage. No airflow and no heat sink applied (reference EIA/JEDEC 51.7). It also does not account for other heat sources that may be present on the PCB next to the device in question (such as inductors, resistors etc.) 3. The maximum power dissipation (PD) is dependent on input voltage, output voltage, output current, external components selected, and PCB layout. The reference data is obtained based on TJMAX = 125°C and RθJA = 21.8°C/W. 4. Moisture Sensitivity Level (MSL): 3 per IPC/JEDEC standard: J−STD−020D.1. |
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