NCP81074A, NCP81074B

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3

PIN DESCRIPTION

Pin No.

Symbol

Description

1

IN+

Non−Inverting Input which has logic compatible threshold and hysteresis. If not used, this pin should be

connected to either VDD or GND. It should not be left unconnected.

2

GND

Common ground. This ground should be connected very closely to the source of the power MOSFET.

3

GND

Common ground. This ground should be connected very closely to the source of the power MOSFET.

4

OUTL

Sink pin. Connect to Gate of MOSFET.

5

OUTH

Source Pin. Connect to Gate of MOSFET.

6

VDD

Power Supply Input Pin.

7

VDD

Power supply Input Pin.

8

IN−

Inverting Input which has logic compatible threshold and hysteresis. If not used, this pin should be connect-

ed to either VDD or GND. It should not be left unconnected

Figure 2. TYPICAL APPLICATION CIRCUIT

ABSOLUTE MAXIMUM RATINGS

Parameter

Value

Unit

Min

Max

Supply Voltage

VDD

−0.3

24

V

Output Current (DC)

Iout_dc

0.6

A

Reverse Current (Pulse<1

ms)

10

A

Output Current (Pulse<0.5

ms)

Iout_pulse

10

A

Input Voltage

IN+, IN−

−6

24

V

Output Voltages

OUTH, OUTL

−0.3

VDD + 0.3

V

Output Voltages (Pulse<0.5

ms)

OUTH, OUTL

−3.0

VDD + 3.0

V

Junction Operation Temperature

−40

150

°C

Storage Temperature

−65

160

Electrostatic Discharge

Human body model, HBM

4000

V

Charge device model, CDM

1000

OUT Latch−up Protection

500

mA

Moisture Sensitivity Level (MSL)

MSL1

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.