LE25U20AQG datasheet(2/21 Pages) ONSEMI

Part #	LE25U20AQG

Description	Serial Flash Memory

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Manufacturer	ONSEMI [ON Semiconductor]

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LE25U20AQG

www.onsemi.jp

2

Package Dimensions

unit : mm

Figure 1 Pin Assignments

WDFN8 2x3, 0.5P

CASE 511BY

ISSUE O

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED

TERMINAL AND IS MEASURED BETWEEN

0.15 AND 0.25MM FROM THE TERMINAL TIP.

4. COPLANARITY APPLIES TO THE EXPOSED

PAD AS WELL AS THE TERMINALS.

A

D

E

B

C

0.10

PIN ONE

REFERENCE

TOP VIEW

SIDE VIEW

BOTTOM VIEW

L

D2

E2

C

0.10

C

0.08

A1

SEATING

PLANE

NOTE 3

b

8X

0.10

C

0.05

C

A B

DIM

MIN

MAX

MILLIMETERS

A

0.70

0.80

A1

0.00

0.05

b

0.20

0.30

D

2.00 BSC

D2

1.40

1.60

E

3.00 BSC

E2

1.80

2.00

e

0.50 BSC

L

0.25

0.35

1

4

8

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

0.50

PITCH

2.04 3.30

1

DIMENSIONS: MILLIMETERS

NOTE 4

0.32

8X

DETAIL A

A3

0.20 REF

A3

A

DETAIL B

L1

DETAIL A

L

ALTERNATE

CONSTRUCTIONS

L

DETAIL B

MOLD CMPD

EXPOSED Cu

ALTERNATE

CONSTRUCTIONS

L1

−−−

0.15

e

RECOMMENDED

5

1.66

GENERIC

MARKING DIAGRAM*

XXXXX = Specific Device Code

A

= Assembly Location

WL

= Wafer Lot

Y

= Year

W

= Work Week

= Pb−Free Package

*This information is generic. Please refer to

device data sheet for actual part marking.

XXXXX

AWLYW

1

A

M

0.10

B

C

M

A

M

0.10

B

C

0.50

C

0.10

8X

Bottom View

1

2

3

4

8

7

6

5

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