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NMF3506 Datasheet(PDF) 1 Page - ON Semiconductor |
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NMF3506 Datasheet(HTML) 1 Page - ON Semiconductor |
1 / 6 page © Semiconductor Components Industries, LLC, 2004 March, 2004 − Rev. P0 1 Publication Order Number: NMF3506/D NMF3506 Advance Information RF Filtering and ESD Protection on I2C Bus and Digital Line, Thermal Shutdown and Power Switch with Short Circuit Protection The NMF3506 interfaces with mobile phone accessories using I2C bus. It includes two I2C line filters and a general purpose digital line filter. It is compliant with EMC international standards required for cellular phones and portable equipment. It also includes a low voltage drop power switch to control the accessory supply. It has safety features such as thermal shutdown and main switch short circuit protection. All I/O are ESD protected according to the stringent IEC 61000−4−2 international standard. Features • ESD Protection IEC 61000−4−2 Level 4 (Vbatt and Output Pins) • ESD Protection IEC 61000−4−2 Level 1 (All I/O) • RF Filtering (800 MHz–6.0 GHz): −25 dB • RF Filtering (1.0 GHz–2.5 GHz): −30 dB • Power Switch: 120 mA (<200 mV) • Voltage Drop Across Power Switch: <200 mV • Controlled I2C Bias • Low Quiescent Current, 10 mA off, 100 mAon • 15 Bump Flip−Chip Direct Chip Attach: 2.1 mm x 2.1 mm x 0.65 mm • This is a Pb−Free Device Typical Application • Cellular Phones • Portable Equipment This document contains information on a new product. Specifications and information herein are subject to change without notice. http://onsemi.com FLIP−CHIP 15 CSP CASE TBD MARKING DIAGRAM xx xx LYW xx = Specific Device Code L = Wafer Lot Y = Year W = Work Week Device Package Shipping† ORDERING INFORMATION NMF3506FCT1G Flip−Chip 3000 Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. A1 A1 |
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