P6P82PS01A

http://onsemi.com

5

PACKAGE DIMENSIONS

WDFN8 2x2, 0.5P

CASE 511AQ−01

ISSUE A

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED

TERMINAL AND IS MEASURED BETWEEN

0.15 AND 0.30mm FROM TERMINAL.

C

A

SEATING

PLANE

D

E

0.10 C

A3

A

A1

0.10 C

DIM

A

MIN

MILLIMETERS

0.70

A1

0.00

A3

0.20 REF

b

0.20

D

2.00 BSC

E

2.00 BSC

e

0.50 BSC

PIN ONE

REFERENCE

0.05 C

0.05 C

8X

A

0.10 C

NOTE 3

L

e

b

B

4

5

8X

1

8

0.05 C

0.50

L

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

2.30

0.50

0.78

7X

DIMENSIONS: MILLIMETERS

BOTTOM VIEW

0.35

PITCH

8X

0.80

0.05

0.30

0.60

MAX

L1

DETAIL A

L

OPTIONAL

CONSTRUCTIONS

L

DETAIL B

MOLD CMPD

EXPOSED Cu

OPTIONAL

CONSTRUCTION

---

L1

0.15

B

TOP VIEW

SIDE VIEW

e/2

1

PACKAGE

OUTLINE

DETAIL B

DETAIL A

2X

2X

8X

RECOMMENDED

0.88

ON Semiconductor and

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