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Material Content Data Sheet

Sales Product Name

BSZ086P03NS3E G

Issued

7. October 2015

MA#

MA001413074

Package

PG-TSDSON-8-2

Weight*

40.21 mg

Construction Element

Material Group

Substances

CAS#

if applicable

Weight

[mg]

Average

Mass

[%]

Sum

[%]

Average

Mass

[ppm]

Sum

[ppm]

chip

inorganic material

silicon

7440-21-3

1.835

4.56

4.56

45635

45635

leadframe

inorganic material

phosphorus

7723-14-0

0.002

0.01

52

non noble metal

zinc

7440-66-6

0.008

0.02

208

non noble metal

iron

7439-89-6

0.168

0.42

4170

non noble metal

copper

7440-50-8

6.808

16.93

17.38

169313

173743

wire

non noble metal

copper

7440-50-8

0.036

0.09

0.09

885

885

encapsulation

organic material

carbon black

1333-86-4

0.037

0.09

909

plastics

epoxy resin

-

1.882

4.68

46818

inorganic material

silicondioxide

60676-86-0

16.357

40.70

45.47

406817

454544

leadfinish

non noble metal

tin

7440-31-5

0.392

0.97

0.97

9749

9749

plating

noble metal

silver

7440-22-4

0.963

2.39

2.39

23940

23940

solder

non noble metal

tin

7440-31-5

0.037

0.09

915

noble metal

silver

7440-22-4

0.046

0.11

1144

non noble metal

lead

7439-92-1

1.758

4.37

4.57

43713

45772

heatspreader

inorganic material

phosphorus

7723-14-0

0.001

0.00

27

non noble metal

zinc

7440-66-6

0.004

0.01

107

non noble metal

iron

7439-89-6

0.086

0.21

2145

non noble metal

copper

7440-50-8

3.501

8.71

8.93

87077

89356

heat sink CLIP

inorganic material

phosphorus

7723-14-0

0.002

0.00

47

non noble metal

zinc

7440-66-6

0.008

0.02

188

non noble metal

iron

7439-89-6

0.151

0.38

3753

non noble metal

copper

7440-50-8

6.127

15.24

15.64

152388

156376

*deviation

< 10%

Sum in total:

100.00

1000000

Important Remarks:

Infineon Technologies AG provides full material declaration based on information provided by third parties and

has taken and continues to take reasonable steps to provide representative and accurate information.

Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be

proprietary, and thus CAS numbers and other limited information may not be available for release.

All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any

time due to technical requirements and development without notification.

This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption

7a, Lead in high melting temperature type solders.

Company

Infineon Technologies AG

Address

81726 München

Internet

www.infineon.com