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ISO7320-Q1 Datasheet(PDF) 4 Page - Texas Instruments

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Part # ISO7320-Q1
Description  ISO732x-Q1 Robust EMC, Low Power, Dual-Channel Digital Isolators
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

ISO7320-Q1 Datasheet(HTML) 4 Page - Texas Instruments

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ISO7320-Q1
ISO7321-Q1
SLLSER4 – NOVEMBER 2015
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
VCC
Supply voltage(2)
VCC1 , VCC2
–0.5
6
V
Voltage(2)
INx, OUTx
–0.5
VCC+ 0.5
(3)
V
IO
Output current
±15
mA
TJ
Junction temperature
150
°C
Tstg
Storage temperature
–65
150
°C
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltage values are with respect to network ground terminal and are peak voltage values.
(3)
Maximum voltage must not exceed 6 V.
6.2 ESD Ratings
VALUE
UNIT
Human-body model (HBM), per AEC Q100-002(1)
±4000
V(ESD)
Electrostatic discharge
V
Charged-device model (CDM), per AEC Q100-011
±1500
(1)
AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
6.3 Recommended Operating Conditions
MIN
NOM
MAX
UNIT
VCC1, VCC2
Supply voltage,
3
5.5
V
IOH
High-level output current
–4
mA
IOL
Low-level output current
4
mA
VIH
High-level input voltage
2
5.5
V
VIL
Low-level input voltage
0
0.8
V
tui
Input pulse duration
40
ns
1 / tui
Signaling rate
0
25
Mbps
TJ
(1)
Junction temperature
136
°C
TA
Ambient temperature
-40
25
125
°C
(1)
To maintain the recommended operating conditions for TJ, see the Thermal Information table.
6.4 Thermal Information
ISO732x-Q1
THERMAL METRIC(1)
D (SOIC)
UNIT
8 PINS
RθJA
Junction-to-ambient thermal resistance
121
°C/W
RθJCtop
Junction-to-case (top) thermal resistance
67.9
°C/W
RθJB
Junction-to-board thermal resistance
61.6
°C/W
ψJT
Junction-to-top characterization parameter
21.5
°C/W
ψJB
Junction-to-board characterization parameter
61.1
°C/W
RθJCbot
Junction-to-case (bottom) thermal resistance
N/A
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4
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Copyright © 2015, Texas Instruments Incorporated
Product Folder Links: ISO7320-Q1 ISO7321-Q1


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