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ISO7320-Q1 Datasheet(PDF) 4 Page - Texas Instruments |
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ISO7320-Q1 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 28 page ISO7320-Q1 ISO7321-Q1 SLLSER4 – NOVEMBER 2015 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VCC Supply voltage(2) VCC1 , VCC2 –0.5 6 V Voltage(2) INx, OUTx –0.5 VCC+ 0.5 (3) V IO Output current ±15 mA TJ Junction temperature 150 °C Tstg Storage temperature –65 150 °C (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to network ground terminal and are peak voltage values. (3) Maximum voltage must not exceed 6 V. 6.2 ESD Ratings VALUE UNIT Human-body model (HBM), per AEC Q100-002(1) ±4000 V(ESD) Electrostatic discharge V Charged-device model (CDM), per AEC Q100-011 ±1500 (1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification. 6.3 Recommended Operating Conditions MIN NOM MAX UNIT VCC1, VCC2 Supply voltage, 3 5.5 V IOH High-level output current –4 mA IOL Low-level output current 4 mA VIH High-level input voltage 2 5.5 V VIL Low-level input voltage 0 0.8 V tui Input pulse duration 40 ns 1 / tui Signaling rate 0 25 Mbps TJ (1) Junction temperature 136 °C TA Ambient temperature -40 25 125 °C (1) To maintain the recommended operating conditions for TJ, see the Thermal Information table. 6.4 Thermal Information ISO732x-Q1 THERMAL METRIC(1) D (SOIC) UNIT 8 PINS RθJA Junction-to-ambient thermal resistance 121 °C/W RθJCtop Junction-to-case (top) thermal resistance 67.9 °C/W RθJB Junction-to-board thermal resistance 61.6 °C/W ψJT Junction-to-top characterization parameter 21.5 °C/W ψJB Junction-to-board characterization parameter 61.1 °C/W RθJCbot Junction-to-case (bottom) thermal resistance N/A °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ISO7320-Q1 ISO7321-Q1 |
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