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DAC8803IDBRG4 Datasheet(PDF) 2 Page - Texas Instruments |
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DAC8803IDBRG4 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 26 page www.ti.com ABSOLUTE MAXIMUM RATINGS (1) DAC8803 SBAS340C – JANUARY 2005 – REVISED FEBRUARY 2006 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE/ORDERING INFORMATION(1) MINIMUM RELATIVE DIFFERENTIAL SPECIFIED TRANSPORT ACCURACY NONLINEARITY TEMPERATURE PACKAGE- PACKAGE ORDERING MEDIA PRODUCT (LSB) (LSB) RANGE LEAD DESIGNATOR NUMBER QUANTITY DAC8803IDBT Tape and Reel, 250 DAC8803 ±1 ±1 -40°C to +85°C SSOP-28 DB DAC8803IDBR Tape and Reel, 2500 (1) For the most current specifications and package information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com DAC8803 UNIT VDD to GND -0.3 to +8 V VREF to GND -18 to +18 V Logic inputs and output to GND -0.3 to +8 V V(IOUT) to GND -0.3 to VDD + 0.3 V AGNDX to DGND -0.3 to +0.3 V Input current to any pin except supplies ±50 mA Package power dissipation (TJmax - TA)/θJA W Thermal resistance, θ JA 28-Lead shrink surface-mount (RS-28) 100 °C/W Maximum junction temperature (TJmax) 150 °C Operating temperature range, Model A -40 to +85 °C Storage temperature range -65 to +150 °C (1) Stresses above those listed under absolute maximum ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum conditions for extended periods may affect device reliability. 2 Submit Documentation Feedback |
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