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C0402C0G1C560JT Datasheet(PDF) 7 Page - TDK Electronics |
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C0402C0G1C560JT Datasheet(HTML) 7 Page - TDK Electronics |
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7 / 34 page  — 6 — (continued) No. Item Performance Test or inspection method 11 Solderability (C0402) Both end faces and the contact areas shall be covered with a smooth and bright solder coating with no more than a small amount of scattered imperfections such as pinholes or un-wetted or de-wetted areas. These imperfections shall not be concentrated in one area. (Others) New solder to cover over 75% of termination. 25% may have pin holes or rough spots but not concentrated in one spot. Ceramic surface of A sections shall not be exposed due to melting or shifting of termination material. Completely soak both terminations in solder at 235±5°C for 2 ± 0.5s. Solder : H63A (JIS Z 3282) Flux: Isopropyl alcohol (JIS K 8839) Rosin (JIS K 5902) 25% solid solution. Only reflow soldering applicable to C0402. Peak condition Temp. : 235±5°C Time: 2±0.5s. Preheating condition Temp. : 150±10°C Time: 1 to 2min. A section |
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