LM73

SNIS141F – OCTOBER 2005 – REVISED OCTOBER 2015

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

NOM

MAX

UNIT

Supply Voltage

−0.3

V to 6

V

Voltage at SMBCLK and SMBDAT pins

−0.3 V to V

6

V

Voltage at All Other Pins

−0.3

6

V

±5

mA

−65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Soldering process must comply with Texas Instruments' Reflow Temperature Profile specifications. Refer to www.ti.com/packaging..

Reflow temperature profiles are different for lead-free and non-lead-free packages.

(3)

mA.

6.2 ESD Ratings

VALUE

UNIT

±2000

Electrostatic discharge

V

Machine Model

±200

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

LM73CIMK-0, LM73CIMK-1

–40

150

°C

2.7

5.5

V

6.4 Thermal Information

LM73

DDC (SOT)

UNIT

6 PINS

Junction-to-ambient thermal resistance

224

°C/W

Junction-to-case (top) thermal resistance

89

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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