LM95214

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SNIS146A – MARCH 2007 – REVISED MARCH 2013

Absolute Maximum Ratings

(1)

Supply Voltage

−0.3 to 6.0V

Voltage at SMBDAT, SMBCLK, TCRIT1, TCRIT2, TCRIT3

−0.5 to 6.0

Voltage at Other Pins

D

− Input Current

±1 mA

±5 mA

30 mA

Output Sink Current SMBDAT, TCRIT1, TCRIT2, TCRIT3

10 mA

Storage Temperature

−65 to +150°C

Human Body Model

2000V

Machine Model

200V

Charge Device Model

1000V

Soldering process must comply with Texas Instruments' reflow temperature profile specifications. Refer to http://www.ti.com/packaging(4)

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not

apply when operating the device beyond its rated operating conditions.

(2)

mA. Parasitic components and or ESD protection circuitry are shown in the table below for the LM95214's pins.

(3)

Human body model, 100 pF discharged through a 1.5 k

Ω resistor. Machine model, 200 pF discharged directly into each pin. Charged

Device Model (CDM) simulates a pin slowly acquiring charge (such as from a device sliding down the feeder in an automated

assembler) then rapidly being discharged.

(4)

Reflow temperature profiles are different for packages containing lead (Pb) than for those that do not.

Operating Ratings

(1) (2)

Operating Temperature Range

−40 to +140°C

Electrical Characteristics Temperature Range

LM95214CISD

+3.0 to +3.6V

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not

apply when operating the device beyond its rated operating conditions.

(2)

Thermal resistance junction-to-ambient when attached to a 4 layer printed circuit board per JEDEC standard JESD51-7:

– 14-lead WSON = 90°C/W (no thermal vias, no airflow)

– 14-lead WSON = 63°C/W (1 thermal via, no airflow)

– 14-lead WSON = 43°C/W (6 thermal vias, no airflow)

– 14-lead WSON = 31°C/W (6 thermal vias, 900 ln. ft. / min. airflow)

Note, all quoted values include +15% error factor from nominal value.

Temperature-to-Digital Converter Electrical Characteristics

Parameter

Conditions

Units

(Limit)

Temperature Error Using Local Diode

(3)

±1

±2

°C (max)

Temperature Error Using an MMBT3904

±1.1

°C (max)

±1.3

°C (max)

±3.0

°C (max)

±3.3

°C (max)

(1)

(2)

Limits are specified to AOQL (Average Outgoing Quality Level).

(3)

Local temperature accuracy does not include the effects of self-heating. The rise in temperature due to self-heating is the product of the

internal power dissipation of the LM95214 and the thermal resistance. See Note 2 under Operating Ratings table for the thermal

resistance to be used in the self-heating calculation.

(4)

The accuracy of the LM95214CISD is ensured when using a typical MMBT3904 diode-connected transistor. For further information on

other thermal diodes see applications DIODE NON-IDEALITY.

Copyright © 2007–2013, Texas Instruments Incorporated

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