TLV5619EP

2.7 V TO 5.5 V 12BIT PARALLEL DIGITALTOANALOG CONVERTER

WITH POWER DOWN

SGLS124A − JULY 2002 − REVISED DECEMBER 2003

1

POST OFFICE BOX 655303

− One Assembly/Test Site, One Fabrication

Site

−40

°C to 125°C

Sources (DMS) Support

±1.5 LSB Integral Nonlinearity (INL)

− 8 mW for 5-V Supply

− 4.3 mW for 3-V Supply

† Component qualification in accordance with JEDEC and industry

standards to ensure reliable operation over an extended

temperature range. This includes, but is not limited to, Highly

Accelerated Stress Test (HAST) or biased 85/85, temperature

cycle, autoclave or unbiased HAST, electromigration, bond

intermetallic life, and mold compound life. Such qualification

testing should not be viewed as justifying use of this component

beyond specified performance and environmental limits.

applications

Controls

description

The TLV5619 is a 12-bit voltage output DAC with a microprocessor and TMS320 compatible parallel interface.

The 12 data bits are double buffered so that the output can be updated asynchronously using the LDAC pin.

During normal operation, the device dissipates 8 mW at a 5-V supply and 4.3 mW at a 3-V supply. The power

consumption can be lowered to 50 nW by setting the DAC to power-down mode.

The output voltage is buffered by a

×2 gain rail-to-rail amplifier, which features a Class A output stage to improve

stability and reduce settling time.

ORDERING INFORMATION

TA

PACKAGE‡

ORDERABLE

PART NUMBER

TOP-SIDE

MARKING

−40

°C to 125°C

SOP − DW

Tape and reel

TLV5619QDWREP

TLV5619QEP

‡ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines

are available at www.ti.com/sc/package.

Copyright

 2002 − 2003, Texas Instruments Incorporated

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of Texas Instruments

standard warranty. Production processing does not necessarily include

testing of all parameters.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

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D2

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D5

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D11

D1

D0

CS

WE

LDAC

PD

GND

OUT

REFIN

DW PACKAGE

(TOP VIEW)