Electronic Components Datasheet Search |
|
SM74101 Datasheet(PDF) 11 Page - Texas Instruments |
|
|
SM74101 Datasheet(HTML) 11 Page - Texas Instruments |
11 / 23 page SM74101 www.ti.com SNOSBA2B – JULY 2011 – REVISED MAY 2015 Thermal Considerations (continued) PD = 0.118 + 0.008 + 0.012 = 0.138W. (3) We know that the junction temperature is given by TJ = PD x θJA + TA (4) Or the rise in temperature is given by TRISE = TJ − TA = PD x θJA (5) For WSON-6 package, the integrated circuit die is attached to leadframe die pad which is soldered directly to the printed circuit board. This substantially decreases the junction to ambient thermal resistance ( θJA). By providing suitable means of heat dispersion from the IC to the ambient through exposed copper pad, which can readily dissipate heat to the surroundings, θJA as low as 40°C / Watt is achievable with the package. The resulting Trise for the driver example above is thereby reduced to just 5.5 degrees. Therefore TRISE is equal to TRISE = 0.138 x 40 = 5.5°C (6) Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback 11 Product Folder Links: SM74101 |
Similar Part No. - SM74101 |
|
Similar Description - SM74101 |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.COM |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Datasheet Upload | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |