TPS2838, TPS2839

TPS2848, TPS2849

SLVS367A − MARCH 2001 − REVISED JUNE 2001

6

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DISSIPATION RATING TABLE

PACKAGE

TA ≤ 25°C

DERATING FACTOR

TA = 70°C

TA = 85°C

14-pin PWP with solder‡

2668

26.68 mW/

°C

1467

1067

14-pin PWP without solder‡

1024

10.24 mW/

°C

563

409

16-pin PWP with solder‡

2739

27.39 mW/

°C

1506

1095

16-pin PWP without solder‡

1108

11.08 mW/

°C

609

443

JUNCTION-CASE THERMAL RESISTANCE TABLE

14-pin PWP

Junction-case thermal resistance

2.07

°C/W

16-pin PWP

Junction-case thermal resistance

2.07

°C/W

‡ Test Board Conditions:

1. Thickness: 0.062

I

2. 3

I × 3I (for packages < 27 mm long)

3. 4

I × 4I (for packages > 27 mm long)

4. 2-oz copper traces located on the top of the board (0,071 mm thick)

5. Copper areas located on the top and bottom of the PCB for soldering

6. Power and ground planes, 1-oz copper (0,036 mm thick)

7. Thermal vias, 0,33 mm diameter, 1,5 mm pitch

8. Thermal isolation of power plane

For more information, refer to TI technical brief literature number SLMA002.

recommended operating conditions

MIN

NOM

MAX

UNIT

Supply voltage, VCC

10

15

V

Input voltage, VI BOOT to PGND

10

29

V

electrical characteristics over recommended operating virtual junction temperature range,

supply current

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

ICC

Quiescent current

V(ENABLE) = Low,

VCC = 13 V

425

µA

ICC

Quiescent current

V(ENABLE) = High,

VCC = 13 V

1

mA

NOTE 2: Ensured by design, not production tested.