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L Datasheet(PDF) 3 Page - Vishay Siliconix

Part No. L
Description  SMD Wraparound Ultra Low Value Thin Film Resistors
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Maker  VISHAY [Vishay Siliconix]
Homepage  http://www.vishay.com
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 3 page
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L
www.vishay.com
Vishay Sfernice
Revision: 04-Sep-14
3
Document Number: 53018
For technical questions, contact: sferthinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
POWER DERATING CURVE
PACKAGING
Several types of packaging are proposed: waffle-pack and
tape and reel
PACKAGING RULES
Waffle Pack
Can be filled up to maximum quantity indicated in the table
here above, taking into account the minimum order quantity.
When quantity ordered exceeds maximum quantity of a
single waffle pack, the waffle packs are stacked up on the
top of each other and closed by one single cover.
To get “not stacked up” waffle pack in case of ordered
quantity > maximum number of pieces per package:
Please consult Vishay/Sfernice for specific ordering
code.
Tape and Reel
Can be filled up to maximum quantity indicated in the table
here above, taking into account the minimum order quantity.
When quantity ordered is between the MOQ and the
maximum reel capacity, only one reel is provided.
When several reels are needed for ordered quantity
within MOQ and maximum reel capacity: Please consult
Vishay Sfernice for specific ordering code.
070
20
40
60
80
100
120
140 155
0
20
40
60
80
100
Ambient Temperature in °C
SIZE
MOQ
NUMBER OF PIECES
PER PACKAGE
TAPE
WIDTH
WAFFLE PACK
2" × 2"
TAPE AND REEL
MIN.
MAX.
0603
100
100
100
5000
8 mm
0805
4000
1206
140
1505
60
2010
2000
2512
50
PERFORMANCE
TESTS
CONDITIONS
VALUES AND DRIFT
MIL-R-55342
REQUIREMENTS
TYPICAL
PERFORMANCES
Thermal shock
MIL-R-55342 C
MIL-STD-702, method 107
± 0.25 %
± 0.02 %
Short time overload
MIL-R-55342 C
PARA 3.10.4.7.5
± 0.10 %
± 0.01 %
Low temperature operation
MIL-R-55342 C
PARA 3.9 and 4.7.4
± 0.25 %
± 0.01 %
Resistance to solder heat
MIL-R-55342 C
PARA 3.12, 4.7.7, 4.7.1.2
± 0.25 %
± 0.04 %
Moisture resistance
MIL-R-55342 C
PARA 3.13 and 4.7.8
MIL-STD-202, method 106
± 0.40 %
± 0.01 %
AEC-Q200
85 °C/85 % RH/0.1 Pn
1000 h
-
Max. < 0.5 % + 0.05
High temperature
MIL-R-55342 C
PARA 3.11 and 4.7.6
± 0.20 %
± 0.075 %
Load life
MIL-R-55342 C
2000 h Pn at 70 °C
MIL-STD-202, method 108
± 0.50 %
± 0.15 %




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