NL3HS2222

www.onsemi.com

10

PACKAGE DIMENSIONS

UQFN10 1.4x1.8, 0.4P

CASE 488AT−01

ISSUE A

MOUNTING FOOTPRINT*

10 X

PITCH

1

9 X

SCALE 20:1

0.663

0.0261

0.200

0.0079

0.400

0.0157

0.225

0.0089

2.100

0.0827

1.700

0.0669

0.563

0.0221

mm

inches

*For additional information on our Pb−Free strategy

and soldering details, please download the

ON Semiconductor Soldering and Mounting

Techniques Reference Manual, SOLDERRM/D.

A

b

A1

0.05 C

SEATING

PLANE

NOTE 3

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME

Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS

3. DIMENSION b APPLIES TO PLATED TERMINAL

AND IS MEASURED BETWEEN 0.25 AND 0.30 MM

FROM TERMINAL.

4. COPLANARITY APPLIES TO THE EXPOSED PAD

AS WELL AS THE TERMINALS.

DIM

MIN

MAX

MILLIMETERS

A

1.40 BSC

A1

0.40 BSC

0.45

0.60

b

D

0.30

0.50

E

e

L

L1

0.00

0.05

PIN 1 REFERENCE

D

A

E

B

0.10 C

2X

0.10 C

2X

0.05 C

C

L3

10

1

3

5

6

0.05 C

0.10 CA B

10 X

e

e/2

L

9 X

0.00

0.15

1.80 BSC

0.15

0.25

10X

L1

DETAIL A

Bottom View

(Optional)

A1

A3

DETAIL B

Side View

(Optional)

EDGE OF PACKAGE

MOLD CMPD

EXPOSED Cu

L3

0.40

0.60

0.127 REF

A3

TOP VIEW

SIDE VIEW

BOTTOM VIEW

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NL3HS2222/D

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