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NCV7519 Datasheet(PDF) 5 Page - ON Semiconductor |
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NCV7519 Datasheet(HTML) 5 Page - ON Semiconductor |
5 / 38 page NCV7519, NCV7519A www.onsemi.com 5 MAXIMUM RATINGS (Voltages are with respect to device substrate.) Rating Value Unit DC Supply − VLOAD −0.3 to 45 V DC Supply − VCC1, VCC2, VDD −0.3 to 5.8 V Difference Between VCC1 and VCC2 ±0.3 V Difference Between GND (Substrate) and VSS ±0.3 V Drain Input Clamp Forward Voltage Transient ( ≤2 ms, ≤1% duty) 78 V Drain Input Clamp Forward Current Transient ( ≤2 ms, ≤1% duty) 10 mA Drain Input Clamp Energy Repetitive ( ≤2 ms, ≤1% duty) 1.56 mJ Drain Input Clamp Reverse Current VDRNX ≥ −1.0 V −50 mA Input Voltage (Any Input Other Than Drain) −0.3 to 5.8 V Output Voltage (Any Output) −0.3 to 5.8 V Junction Temperature, TJ −40 to 150 °C Storage Temperature, TSTG −65 to 150 °C Peak Reflow Soldering Temperature: Lead−free 60 to 150 seconds at 217 °C (Note 1) 260 peak °C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. See or download ON Semiconductor’s Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ATTRIBUTES Characteristic Value ESD Capability Human Body Model per AEC−Q100−002 Machine Model per AEC−Q100−003 Drain Feedback Pins (Note 3) All Other Pins ≥ ±4.0 kV ≥ ±2.0 kV ≥ ±200 V Moisture Sensitivity (Note 2) MSL3 Package Thermal Resistance − Still−air Junction−to−Ambient, R qJA Junction−to−Exposed Pad, R YJPAD (Note 4) (Note 5) 95 °C/W 46 °C/W 3.2 °C/W 2. See or download ON Semiconductor’s Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 3. With GND & VSS pins tied together − path between drain feedback pins and GND, or between drain feedback pins. 4. Based on JESD51−3, 1.2 mm thick FR4, 2S0P PCB, 2 oz. signal, 20 thermal vias to 400 mm2 spreader on bottom layer. 5. Based on JESD51−7, 1.2 mm thick FR4, 1S2P PCB, 2 oz. signal, 20 thermal vias to 80 x 80 mm 1 oz. internal spreader planes. RECOMMENDED OPERATING CONDITIONS Symbol Parameter MIN MAX Unit VLOAD Diagnostic References and Currents Power Supply Voltage 7.5 36.0 V VDRNX Drain Input Feedback Voltage −0.3 60 V VCC1 Main Power Supply Voltage 4.75 5.25 V VCC2 Gate Drivers Power Supply Voltage VCC1 − 0.3 VCC1 + 0.3 V VDD Serial Output Driver Power Supply Voltage 3.0 VCC1 V VFLTREF Fault Detect Threshold Reference Voltage 0.35 2.75 V VIN High Logic High Input Voltage 2.0 VCC1 V VIN Low Logic Low Input Voltage 0 0.8 V TA Ambient Still−air Operating Temperature −40 125 °C tRESET Startup Delay at Power−on Reset (POR) (Note 6) 500 − ms Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. 6. Minimum wait time until device is ready to accept serial input data. |
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