NCV7519, NCV7519A

www.onsemi.com

5

Rating

Value

Unit

−0.3 to 45

V

−0.3 to 5.8

V

±0.3

V

±0.3

V

Drain Input Clamp Forward Voltage Transient (

≤2 ms, ≤1% duty)

78

V

Drain Input Clamp Forward Current Transient (

≤2 ms, ≤1% duty)

10

mA

Drain Input Clamp Energy Repetitive (

≤2 ms, ≤1% duty)

1.56

mJ

−50

mA

Input Voltage (Any Input Other Than Drain)

−0.3 to 5.8

V

Output Voltage (Any Output)

−0.3 to 5.8

V

−40 to 150

°C

−65 to 150

°C

Peak Reflow Soldering Temperature: Lead−free 60 to 150 seconds at 217

°C (Note 1)

260 peak

°C

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

1. See or download ON Semiconductor’s Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.

ATTRIBUTES

Characteristic

Value

ESD Capability

Human Body Model per AEC−Q100−002

Machine Model per AEC−Q100−003

Drain Feedback Pins (Note 3)

All Other Pins

≥ ±4.0 kV

≥ ±2.0 kV

≥ ±200 V

Moisture Sensitivity

(Note 2)

MSL3

Package Thermal Resistance − Still−air

Junction−to−Ambient, R

Junction−to−Exposed Pad, R

(Note 4)

(Note 5)

95

°C/W

46

°C/W

3.2

°C/W

2. See or download ON Semiconductor’s Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.

5. Based on JESD51−7, 1.2 mm thick FR4, 1S2P PCB, 2 oz. signal, 20 thermal vias to 80 x 80 mm 1 oz. internal spreader planes.

RECOMMENDED OPERATING CONDITIONS

Symbol

Parameter

MIN

MAX

Unit

Diagnostic References and Currents Power Supply Voltage

7.5

36.0

V

Drain Input Feedback Voltage

−0.3

60

V

Main Power Supply Voltage

4.75

5.25

V

Gate Drivers Power Supply Voltage

V

Serial Output Driver Power Supply Voltage

3.0

V

Fault Detect Threshold Reference Voltage

0.35

2.75

V

Logic High Input Voltage

2.0

V

Logic Low Input Voltage

0

0.8

V

Ambient Still−air Operating Temperature

−40

125

°C

Startup Delay at Power−on Reset (POR) (Note 6)

500

−

ms

Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond

the Recommended Operating Ranges limits may affect device reliability.

6. Minimum wait time until device is ready to accept serial input data.