© Semiconductor Components Industries, LLC, 2015

February, 2015 − Rev. 4

1

Publication Order Number:

ESD8006/D

ESD8006

ESD Protection Diode

Low Capacitance Array for High Speed

Data Lines

The ESD8006 is specifically designed to protect USB 3.0 and

Thunderbolt interfaces from ESD. Ultra−low capacitance and low

ESD clamping voltage make this device an ideal solution for

protecting voltage sensitive high speed data lines. The flow−through

style package allows for easy PCB layout and matched trace lengths

necessary to maintain consistent impedance between high speed

differential lines.

Features

IEC 61000−4−2 (Level 4)

Site and Control Change Requirements; AEC−Q101 Qualified and

PPAP Capable

Compliant

Typical Applications

Rating

Symbol

Value

Unit

Operating Junction Temperature Range

−55 to +125

°C

Storage Temperature Range

−55 to +150

°C

Lead Solder Temperature −

Maximum (10 Seconds)

260

°C

IEC 61000−4−2 Contact (ESD)

IEC 61000−4−2 Air (ESD)

ESD

ESD

±15

±15

kV

kV

Stresses exceeding those listed in the Maximum Ratings table may damage the

device. If any of these limits are exceeded, device functionality should not be

assumed, damage may occur and reliability may be affected.

See Application Note AND8308/D for further description of

survivability specs.

MARKING

DIAGRAM

Device

Package

Shipping

ORDERING INFORMATION

www.onsemi.com

ESD8006MUTAG

UDFN8

(Pb−Free)

3000 / Tape &

Reel

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specification

Brochure, BRD8011/D.

1

6T = Specific Device Code

M

= Date Code

G

= Pb−Free Package

6TMG

G

(Note: Microdot may be in either location)

PIN CONFIGURATION

UDFN8

CASE 517CB

I/O I/O GND I/O I/O

I/O

GND

GND

GND I/O

1

2

3

456

7

8

9

10

SZESD8006MUTAG

UDFN8

(Pb−Free)

3000 / Tape &

Reel