ASM2P2304NZ

http://onsemi.com

2

Figure 1. Block Diagram

OUTPUT 1

OUTPUT 2

OUTPUT 3

OUTPUT 4

Logic

Control

OE

BUF_IN

Table 2. PIN DESCRIPTION

Pin #

Pin Name

Type

Description

1

BUF_IN (Note 1)

I

Input clock. 5 V Tolerant Input.

2

OE

I

Input pin for Output Enable, active HIGH.

3

Output 1 (Note 2)

O

Output 1.

4

GND

P

Ground.

5

Output 2 (Note 2)

O

Output 2.

6

P

3.3 V Voltage Supply.

7

Output 3 (Note 2)

O

Output 3.

8

Output 4 (Note 2)

O

Output 4.

1. Weak pull down on input.

2. Weak pull down on all outputs.

Table 3. ABSOLUTE MAXIMUM RATINGS

Parameter

Description

Min

Max

Supply Voltage to Ground Potential

−0.5

7

V

DC Input Voltage (Except BUF_IN)

−0.5

V

DC Input Voltage (BUF_IN)

−0.5

7

V

Storage Temperature

−65

+150

°C

Max. Soldering Temperature (10 sec)

260

°C

Junction Temperature

150

°C

Static Discharge Voltage

(As per JEDEC STD22− A114−B)

2000

V

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.