100% KND (Known-Good-Die) SCREENING

a.

b.

100% Visual Inspection i.a.w. method 2072 of MIL-STD-750

DIE ELEMENT EVALUATION

a.

Wafer Lot Evaluation Testing (WLAT) i.a.w. method 5001 of MIL-STD-750, including SEM

b.

c.

Gate Stress Test for 250

µs at VGS= 30 Vdc.

d.

Safe Operating Area i.a.w. method 3474 of MIL-STD-750 at VDS= 160 V, ID= 2.8 A for 10 ms

e.

f.

g.

h.

Temperature Cycling i.a.w. method 1051 of MIL-STD-750, 100 cycles, -55

°C to +150°C

i.

Group A Electrical Testing including dynamic parameters

j.

k.

l.

Die Attach Evaluation i.a.w. method 2017 of MIL-STD-750

m.

Bond Strength Evaluation i.a.w. 2037 of MIL-STD-750

RADIATION EVALUATION

Total Dose Irradiation i.a.w. method 1019 of MIL-STD-750, dose= 100 kRAD, Drain shorted to Source, VGS= 10V

Total Dose Irradiation i.a.w. method 1019 of MIL-STD-750, dose= 100 kRAD, Gate shorted to Source, VDS= 160V

Evaluation criteria: no degradation of the DC electrical parameters exceeding the data sheet limits allowed after total dose irradiation.