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NCL30086ADR2G Datasheet(PDF) 5 Page - ON Semiconductor |
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NCL30086ADR2G Datasheet(HTML) 5 Page - ON Semiconductor |
5 / 28 page NCL30086 www.onsemi.com 5 Table 3. MAXIMUM RATINGS TABLE(S) Symbol Rating Value Unit VCC(MAX) ICC(MAX) Maximum Power Supply voltage, VCC pin, continuous voltage Maximum current for VCC pin −0.3 to 30 Internally limited V mA VDRV(MAX) IDRV(MAX) Maximum driver pin voltage, DRV pin, continuous voltage Maximum current for DRV pin −0.3, VDRV (Note 1) −300, +500 V mA VMAX IMAX Maximum voltage on low power pins (except DRV and VCC pins) Current range for low power pins (except DRV and VCC pins) −0.3, 5.5 (Notes 2 and 5) −2, +5 V mA RθJ−A Thermal Resistance Junction−to−Air 180 °C/W TJ(MAX) Maximum Junction Temperature 150 °C Operating Temperature Range −40 to +125 °C Storage Temperature Range −60 to +150 °C ESD Capability, HBM model (Note 3) 3.5 kV ESD Capability, MM model (Note 3) 250 V ESD Capability, CDM model (Note 3) 2 kV Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. VDRV is the DRV clamp voltage VDRV(high) when VCC is higher than VDRV(high). VDRV is VCC otherwise. 2. This level is low enough to guarantee not to exceed the internal ESD diode and 5.5−V Zener diode. More positive and negative voltages can be applied if the pin current stays within the −2 mA / 5 mA range. 3. This device contains ESD protection and exceeds the following tests: Human Body Model 3500 V per JEDEC Standard JESD22−A114E, Machine Model Method 250 V per JEDEC Standard JESD22−A115B, Charged Device Model 2000 V per JEDEC Standard JESD22−C101E. 4. This device contains latch−up protection and has been tested per JEDEC Standard JESD78D, Class I and exceeds ±100 mA. 5. Recommended maximum VS voltage for optimal operation is 4 V. −0.3 V to +4.0 V is hence, the VS pin recommended range. Table 4. ELECTRICAL CHARACTERISTICS (Unless otherwise noted: For typical values TJ = 25°C, VCC = 12 V, VZCD = 0 V, VCS = 0 V, VSD = 1.5 V) For min/max values TJ = −40°C to +125°C, VCC = 12 V) Description Test Condition Symbol Min Typ Max Unit STARTUP AND SUPPLY CIRCUITS Supply Voltage Startup Threshold Minimum Operating Voltage Hysteresis VCC(on) – VCC(off) Internal logic reset VCC rising VCC rising VCC falling VCC(on) VCC(off) VCC(HYS) VCC(reset) 16.0 8.2 8 4 18.0 8.8 − 5 20.0 9.4 − 6 V VCC Over Voltage Protection Threshold VCC(OVP) 25.5 26.8 28.5 V VCC(off) noise filter VCC(reset) noise filter tVCC(off) tVCC(reset) − − 5 20 − − ms Startup current ICC(start) − 13 30 mA Startup current in fault mode ICC(Fault) 58 75 mA Supply Current Device Disabled/Fault Device Enabled/No output load on DRV pin Device Switching VCC > VCC(off) Fsw = 65 kHz CDRV = 470 pF, Fsw = 65 kHz ICC1 ICC2 ICC3 0.8 – − 1.0 2.6 3.0 1.2 4.0 4.5 mA CURRENT SENSE Maximum Internal current limit VILIM 0.95 1.00 1.05 V Leading Edge Blanking Duration for VILIM tLEB 240 300 360 ns Propagation delay from current detection to gate off−state tILIM − 100 150 ns 6. Guaranteed by Design 7. A NTC is generally placed between the SD and GND pins. Parameters RTF(start), RTF(stop), ROTP(off) and ROTP(on) give the resistance the NTC must exhibit to respectively, enter thermal foldback, stop thermal foldback, trigger the OTP limit and allow the circuit recovery after an OTP situation. 8. At startup, when VCC reaches VCC(on), the controller blanks OTP for more than 250 ms to avoid detecting an OTP fault by allowing the SD pin voltage to reach its nominal value if a filtering capacitor is connected to the SD pin. |
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