LX8585-xx/8585A-xx

PRODUCT DA T ABOOK 1996/1997

Copyright © 1997

Rev. 2.2

12/97

2

ABSOLUTE MAXIMUM RATINGS

(Note 1)

Power Dissipation .................................................................................. Internally Limited

Input Voltage ................................................................................................................ 10V

Input to Output Voltage Differential ........................................................................... 10V

Operating Junction Temperature

Plastic (P, DD Package) ........................................................................................ 150°C

Storage Temperature Range ...................................................................... -65°C to 150°C

Lead Temperature (Soldering, 10 seconds) ............................................................. 300°C

PACKAGE PIN OUTS

P PACKAGE

(Top View)

* Pin 1 is GND for fixed voltage versions.

3

2

1

V

IN

ADJ / GND*

V

OUT

DD PACKAGE

(Top View)

* Pin 1 is GND for fixed voltage versions.

Note 1. Exceeding these ratings could cause damage to the device. All voltages are with respect

to Ground. Currents are positive into, negative out of the specified terminal.

P PACKAGE:

THERMAL RESISTANCE-JUNCTION TO TAB,

θθθθθ

JT

3.0°C/W

THERMAL RESISTANCE-JUNCTION TO AMBIENT,

θθθθθ

JA

60°C/W

DD PACKAGE:

THERMAL RESISTANCE-JUNCTION TO TAB,

θθθθθ

JT

3.0°C/W

THERMAL RESISTANCE-JUNCTION TO AMBIENT,

θθθθθ

JA

60°C/W*

Junction Temperature Calculation: T

The

θ

thermal performance of the device/pc-board system. All of the above assume no ambient airflow.

*

θ

JA

plane or internal power plane.

θ

mounting technique.

THERMAL DATA

V

IN

V

OUT

ADJ / GND*

3

2

1

TAB IS V

OUT

TAB IS V

OUT