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Material Content Data Sheet

Sales Product Name

ESD203-B1-02ELS E6327

Issued

29. August 2013

MA#

MA001118068

Package

PG-TSSLP-2-4

Weight*

0.21 mg

Construction Element

Material Group

Substances

CAS#

if applicable

Weight

[mg]

Average

Mass

[%]

Sum

[%]

Average

Mass

[ppm]

Sum

[ppm]

chip

non noble metal

tin

7440-31-5

0.001

0.33

3268

noble metal

gold

7440-57-5

0.003

1.27

12681

inorganic material

silicon

7440-21-3

0.020

9.40

11.00

93964

109913

leadframe

non noble metal

nickel

7440-02-0

0.108

50.67

50.67

506732

506732

wire

noble metal

gold

7440-57-5

0.003

1.29

1.29

12949

12949

encapsulation

organic material

carbon black

1333-86-4

0.000

0.16

1641

plastics

epoxy resin

-

0.010

4.75

47537

inorganic material

silicondioxide

60676-86-0

0.059

27.87

32.78

278660

327838

leadfinish

noble metal

gold

7440-57-5

0.004

1.73

1.73

17290

17290

plating

noble metal

palladium

7440-05-3

0.001

0.60

5996

noble metal

gold

7440-57-5

0.004

1.93

2.53

19282

25278

*deviation

< 10%

Sum in total:

100,00

1000000

Important Remarks:

Infineon Technologies AG provides full material declaration based on information provided by third parties and

has taken and continues to take reasonable steps to provide representative and accurate information.

Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be

proprietary, and thus CAS numbers and other limited information may not be available for release.

All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any

time due to technical requirements and development without notification.

Company

Infineon Technologies AG

Address

81726 München

Internet

www.infineon.com