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UCC28019A Datasheet(PDF) 4 Page - Texas Instruments |
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UCC28019A Datasheet(HTML) 4 Page - Texas Instruments |
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4 / 52 page  UCC28019A SLUS828C – DECEMBER 2008 – REVISED AUGUST 2015 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings (1) Over operating free-air temperature range unless otherwise noted. Unless noted, all voltages are with respect to GND. Currents are positive into and negative out of the specified terminal. MIN MAX UNIT VCC, GATE –0.3 22 V Input voltage range VINS, VSENSE, VCOMP, ICOMP –0.3 7 V ISENSE –24 7 V Input current range VSENSE, ISENSE –1 1 mA Lead temperature, TSOL Soldering, 10s 300 °C Operating –55 150 °C Junction temperature, TJ Storage –65 150 °C (1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other condition beyond those included under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods of time may affect device reliability. 6.2 ESD Ratings VALUE UNIT Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V V(ESD) Electrostatic discharge Charged-device model (CDM), per JEDEC specification JESD22- ±500 V C101(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VCC input voltage from a low-impedance source VCCOFF + 1 V 21 V Operating junction temperature, TJ -40 125 °C 6.4 Thermal Information UCC28019A THERMAL METRIC(1) P (PDIP) D (SOIC) UNIT 8 PINS 8 PINS RθJA Junction-to-ambient thermal resistance 52.8 113.0 °C/W RθJC(top) Junction-to-case (top) thermal resistance 42.3 61.5 °C/W RθJB Junction-to-board thermal resistance 30.0 53.2 °C/W ψJT Junction-to-top characterization parameter 19.5 15.9 °C/W ψJB Junction-to-board characterization parameter 29.9 52.7 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2008–2015, Texas Instruments Incorporated Product Folder Links: UCC28019A |
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