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NCP6354BMTAATBG Datasheet(PDF) 3 Page - ON Semiconductor |
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NCP6354BMTAATBG Datasheet(HTML) 3 Page - ON Semiconductor |
3 / 15 page NCP6354 http://onsemi.com 3 PWM / PFM Control Reference Voltage L Cout 1uH 10uF Logic Control & Current Limit & Thermal Shutdown Cin 10uF Rpg 1M UVLO Vin Vo Power Good Enable PVIN 8 SW 2 PGND 1 EN 5 PG 6 FB 4 AVIN 7 AGND 3 R1 R2 Cfb Error Amp Figure 2. Functional Block Diagram. MAXIMUM RATINGS Rating Symbol Value Unit Min Max Input Supply Voltage to GND VPVIN , VAVIN −0.3 7.0 V Switch Node to GND VSW −0.3 7.0 V EN, PG to GND VEN, VPG −0.3 7.0 V FB to GND VFB −0.3 2.5 V Human Body Model (HBM) ESD Rating are (Note 1) ESD HBM 2000 V Machine Model (MM) ESD Rating (Note 1) ESD MM 200 V Latchup Current (Note 2) ILU −100 100 mA Operating Junction Temperature Range (Note 3) TJ −40 125 °C Operating Ambient Temperature Range TA −40 85 °C Storage Temperature Range TSTG −55 150 °C Thermal Resistance Junction−to−Top Case (Note 4) RqJC 12 °C/W Thermal Resistance Junction−to−Board (Note 4) RqJB 30 °C/W Thermal Resistance Junction−to−Ambient (Note 4) RqJA 62 °C/W Power Dissipation (Note 5) PD 1.6 W Moisture Sensitivity Level (Note 6) MSL 1 − Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. This device series contains ESD protection and passes the following tests: Human Body Model (HBM) ±2.0 kV per JEDEC standard: JESD22−A114. Machine Model (MM) ±200 V per JEDEC standard: JESD22−A115. 2. Latchup Current per JEDEC standard: JESD78 Class II. 3. The thermal shutdown set to 150°C (typical) avoids potential irreversible damage on the device due to power dissipation. 4. The thermal resistance values are dependent of the PCB heat dissipation. Board used to drive these data was an 80 x 50mm NCP6334EVB board. It is a multilayer board with 1−once internal power and ground planes and 2−once copper traces on top and bottom of the board. If the copper trances of top and bottom are 1−once too, RqJC = 11°C/W, RqJB = 30°C/W, and RqJA = 72°C/W. 5. The maximum power dissipation (PD) is dependent on input voltage, maximum output current and external components selected. 6. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: J−STD−020A. |
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