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NCP6354BMTAATBG Datasheet(PDF) 3 Page - ON Semiconductor

Part # NCP6354BMTAATBG
Description  3MHz, 2A Fixed-Frequency Synchronous Buck Converter
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

NCP6354BMTAATBG Datasheet(HTML) 3 Page - ON Semiconductor

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NCP6354
http://onsemi.com
3
PWM / PFM
Control
Reference
Voltage
L
Cout
1uH
10uF
Logic Control
&
Current Limit
&
Thermal
Shutdown
Cin
10uF
Rpg
1M
UVLO
Vin
Vo
Power Good
Enable
PVIN
8
SW
2
PGND
1
EN
5
PG
6
FB
4
AVIN
7
AGND
3
R1
R2
Cfb
Error
Amp
Figure 2. Functional Block Diagram.
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Min
Max
Input Supply Voltage to GND
VPVIN , VAVIN
−0.3
7.0
V
Switch Node to GND
VSW
−0.3
7.0
V
EN, PG to GND
VEN, VPG
−0.3
7.0
V
FB to GND
VFB
−0.3
2.5
V
Human Body Model (HBM) ESD Rating are (Note 1)
ESD HBM
2000
V
Machine Model (MM) ESD Rating (Note 1)
ESD MM
200
V
Latchup Current (Note 2)
ILU
−100
100
mA
Operating Junction Temperature Range (Note 3)
TJ
−40
125
°C
Operating Ambient Temperature Range
TA
−40
85
°C
Storage Temperature Range
TSTG
−55
150
°C
Thermal Resistance Junction−to−Top Case (Note 4)
RqJC
12
°C/W
Thermal Resistance Junction−to−Board (Note 4)
RqJB
30
°C/W
Thermal Resistance Junction−to−Ambient (Note 4)
RqJA
62
°C/W
Power Dissipation (Note 5)
PD
1.6
W
Moisture Sensitivity Level (Note 6)
MSL
1
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. This device series contains ESD protection and passes the following tests:
Human Body Model (HBM) ±2.0 kV per JEDEC standard: JESD22−A114.
Machine Model (MM) ±200 V per JEDEC standard: JESD22−A115.
2. Latchup Current per JEDEC standard: JESD78 Class II.
3. The thermal shutdown set to 150°C (typical) avoids potential irreversible damage on the device due to power dissipation.
4. The thermal resistance values are dependent of the PCB heat dissipation. Board used to drive these data was an 80 x 50mm NCP6334EVB
board. It is a multilayer board with 1−once internal power and ground planes and 2−once copper traces on top and bottom of the board. If
the copper trances of top and bottom are 1−once too, RqJC = 11°C/W, RqJB = 30°C/W, and RqJA = 72°C/W.
5. The maximum power dissipation (PD) is dependent on input voltage, maximum output current and external components selected.
6. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: J−STD−020A.


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