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NCP458RFCT2G Datasheet(PDF) 4 Page - ON Semiconductor |
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NCP458RFCT2G Datasheet(HTML) 4 Page - ON Semiconductor |
4 / 13 page NCP458R, NCP459 http://onsemi.com 4 MAXIMUM RATINGS Rating Symbol Value Unit IN, OUT, EN, VBIAS, GATE Pins: (Note 1) VEN, VIN , VOUT, VBIAS, VGATE −0.3 to +6.5 V From IN to OUT Pins: Input/Output (Note 1) NCP459 VIN , VOUT 0 to + 6.5 V From IN to OUT Pins: Input/Output (Note 1) NCP458R VIN , VOUT ±6.5 V Human Body Model (HBM) ESD Rating are (Note 2) ESD HBM 2000 V Machine Model (MM) ESD Rating are (Note 2) ESD MM 200 V Latch−up protection (Note 3) − Pins IN, OUT, EN, VBIAS and GATE LU 100 mA Maximum Junction Temperature TJ −40 to + 125 °C Storage Temperature Range TSTG −40 to + 150 °C Moisture Sensitivity (Note 4) MSL Level 1 Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. According to JEDEC standard JESD22−A108. 2. This device series contains ESD protection and passes the following tests: Human Body Model (HBM) ±2.0 kV per JEDEC standard: JESD22−A114 for all pins. Machine Model (MM) ±250 V per JEDEC standard: JESD22−A115 for all pins. 3. Latch up Current Maximum Rating: ±100 mA per JEDEC standard: JESD78 class II. 4. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: J−STD−020. OPERATING CONDITIONS Symbol Parameter Conditions Min Typ Max Unit VIN Operational Power Supply 0.75 5.5 V VEN Enable Voltage 0 5.5 V VBIAS Bias voltage (VBIAS ≥ best of VIN, VOUT) 1.2 5.5 V TA Ambient Temperature Range − 40 25 + 85 °C CIN Decoupling input capacitor 100 nF COUT Decoupling output capacitor 100 nF RqJA Thermal Resistance Junction to Air CSP8 (Note 5) 90 °C/W IOUT DC current 4 4.5 A AC current 1 ms @ 217 Hz 5 A AC current 100 ms spike 15 A PD Power Dissipation Rating (Note 6) 0.315 W Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. 5. The RqJA is dependent of the PCB heat dissipation and thermal via. 6. The maximum power dissipation (PD) is given by the following formula: P D + T JMAX * TA RqJA |
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