NCP451

www.onsemi.com

11

PACKAGE DIMENSIONS

WLCSP6, 1.40x0.90

CASE 567KB

ISSUE A

SEATING

PLANE

0.25 C

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. COPLANARITY APPLIES TO SPHERICAL

CROWNS OF SOLDER BALLS.

2X

DIM

A

MIN

NOM

−−−

MILLIMETERS

A1

D

E

b

0.195

−−−

e

0.50 BSC

−−−

D

E

A

B

PIN A1

REFERENCE

e

A

0.05

B

C

0.03 C

0.05 C

6X

b

AB

C

1

2

0.10 C

A

A1

A2

C

0.142

−−−

0.25 C

2X

TOP VIEW

SIDE VIEW

BOTTOM VIEW

NOTE 3

e

A2

PITCH

0.25

6X

DIMENSIONS: MILLIMETERS

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

0.50

0.50

RECOMMENDED

A1

PACKAGE

OUTLINE

PITCH

e/2

−−−

0.320

−−−

1.400

−−−

0.900

0.235

0.510

0.172

0.338

1.440

0.940

MAX