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TL4050B50QDCKRQ1 Datasheet(PDF) 3 Page - Texas Instruments |
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TL4050B50QDCKRQ1 Datasheet(HTML) 3 Page - Texas Instruments |
3 / 20 page TL4050-Q1 www.ti.com SLOS588F – JUNE 2008 – REVISED APRIL 2013 THERMAL INFORMATION TL4050-Q1 THERMAL METRIC(1) DBZ DCK UNIT 3 PINS 5 PINS θJA Junction-to-ambient thermal resistance(2) 331.1 289.9 °C/W θJCtop Junction-to-case (top) thermal resistance(3) 107.5 56.4 °C/W θJB Junction-to-board thermal resistance(4) 63.4 93 °C/W ψJT Junction-to-top characterization parameter(5) 4.9 0.7 °C/W ψJB Junction-to-board characterization parameter(6) 61.7 91.4 °C/W θJCbot Junction-to-case (bottom) thermal resistance(7) N/A N/A °C/W (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. (2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as specified in JESD51-7, in an environment described in JESD51-2a. (3) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC- standard test exists, but a close description can be found in the ANSI SEMI standard G30-88. (4) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB temperature, as described in JESD51-8. (5) The junction-to-top characterization parameter, ψJT, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining θJA, using a procedure described in JESD51-2a (sections 6 and 7). (6) The junction-to-board characterization parameter, ψJB, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining θJA , using a procedure described in JESD51-2a (sections 6 and 7). (7) The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88. Spacer RECOMMENDED OPERATING CONDITIONS MIN MAX UNIT IZ Cathode current (1) 15 mA I temperature –40 85 TA Free-air temperature °C Q temperature –40 125 (1) See parametric tables Copyright © 2008–2013, Texas Instruments Incorporated Submit Documentation Feedback 3 |
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